公开(公告)号：US20200306931A1

公开(公告)日：2020-10-01

申请号：US16363009

申请日：2019-03-25

Applicant: APPLIED MATERIALS, INC.

Inventor： PRAYUDI LIANTO ,  PENG SUO ,  SHIH-CHAO HUNG ,  PIN GIAN GAN ,  CHUN YU TO ,  PERIYA GOPALAN ,  KOK SEONG TEO ,  LIT PING LAM ,  ANDY LOO ,  PANGYEN ONG ,  DAVID P. SURDOCK ,  KEITH YPMA ,  BRIAN WILLIAMS ,  SCOTT OSTERMAN ,  MARVIN L. BERNT ,  MUHAMMAD NORHAZWAN ,  SAMUEL GOPINATH ,  MUHAMMAD AZIM ,  GUAN HUEI SEE ,  QI JIE PENG ,  SRISKANTHARAJAH THIRUNAVUKARASU ,  ARVIND SUNDARRAJAN

IPC: B24B57/00 ,  H01L21/02 ,  B24B37/34

Abstract: Methods and apparatus for removing particles from a substrate surface after a chemical mechanical polish. In some embodiments, the apparatus may include a manifold configured to receive and atomize a fluid and at least one spray nozzle mounted to the manifold and configured to spray the atomized fluid in a divergent spray pattern such that the substrate surface is cleansed when impinged by spray from the at least one spray nozzle, wherein the at least one spray nozzle sprays the atomized fluid at a pressure of approximately 30 psi to approximately 2500 psi.

公开(公告)号：US20210202334A1

公开(公告)日：2021-07-01

申请号：US16731365

申请日：2019-12-31

Applicant: APPLIED MATERIALS, INC.

Inventor： PENG SUO ,  PRAYUDI LIANTO ,  GUAN HUEI SEE ,  ARVIND SUNDARRAJAN ,  LIT PING LAM ,  PANGYEN ONG ,  OLIVIA KOENTJORO ,  WEI-SHENG LEI ,  JUNGRAE PARK

IPC: H01L23/31 ,  H01L23/538 ,  H01L21/56 ,  H01L23/00 ,  H01L23/522 ,  H01L23/367

Abstract: A method of forming a semiconductor structure on a wafer includes depositing a polymer layer on the wafer in a wafer-level packaging process, forming at least one wafer-level packaging structure in the polymer layer using a direct writing process that alters a chemical property of portions of the polymer layer that have been directly written to, and removing portions of the polymer layer that have not been written to by the direct writing process revealing the at least one wafer-level packaging structure. In some embodiments, the direct writing process is a two-photon polymerization process that uses a femtosecond laser in combination with a pair of galvanometric laser scanners to solidify portions of the polymer layer to form the wafer-level packaging structure.

公开(公告)号：US20190287898A1

公开(公告)日：2019-09-19

申请号：US16296929

申请日：2019-03-08

Applicant: APPLIED MATERIALS, INC.

Inventor： PENG SUO ,  YU GU ,  GUAN HUEI SEE ,  ARVIND SUNDARRAJAN

IPC: H01L23/525

Abstract: Methods and apparatus for forming an embedded antifuse in a wafer-level packaging compatible process. In some embodiments, a method for forming an embedded antifuse includes forming a first redistribution layer on a first polymer layer, depositing an antifuse dielectric layer on the first redistribution layer, forming a second polymer layer on the antifuse dielectric layer, creating at least one first via through the second polymer layer to the antifuse dielectric layer using a lithography process with, for example, a dielectric etch, and forming a second redistribution layer on the second polymer layer and contacting the antifuse dielectric layer at a bottom of the at least one first via.