Abstract:
Embodiments of substrate supports with a heater are provided herein. In some embodiments, a substrate support may include a first member to distribute heat to a substrate when present above a first planar surface of the first member, a second member disposed beneath the first member, the second member including a plurality of resistive heating elements, wherein the plurality of resistive heating elements provide local temperature compensation to the first member to heat the substrate when present, a third member disposed beneath the second member, the third member including one or more base heating zones to provide a base temperature profile to the first member, and a fourth member disposed beneath the third member, the fourth member including a first set of electrical conductors coupled to each of the resistive heating elements.
Abstract:
Embodiments disclose a vibration-controlled robot apparatus. The apparatus includes a robot having an end effector operable to transport a substrate, a sensor coupled to the robot, the sensor operable to sense vibration as the robot transports the substrate, and operating the robot to reduce vibration of the end effector supporting the substrate. In some embodiments, a filter is provided in the motor drive circuit to filter one or more frequencies causing unwanted vibration of the end effector. Vibration control systems and methods of operating the same are provided, as are other aspects.
Abstract:
Apparatus and methods of measuring and controlling the gap between a susceptor assembly and a gas distribution assembly are described. Apparatus and methods for positional control and temperature control for wafer transfer purposes are also described.
Abstract:
Apparatus and methods of measuring and controlling the gap between a susceptor assembly and a gas distribution assembly are described. Apparatus and methods for positional control and temperature control for wafer transfer purposes are also described.
Abstract:
Apparatus and methods of measuring and controlling the gap between a susceptor assembly and a gas distribution assembly are described. Apparatus and methods for positional control and temperature control for wafer transfer purposes are also described.
Abstract:
Apparatus and methods of dimension control and monitoring between a processes fixture and a susceptor, and position determination of wafers are described.
Abstract:
Embodiments disclose a vibration-controlled robot apparatus. The apparatus includes a robot having an end effector operable to transport a substrate, a sensor coupled to the robot, the sensor operable to sense vibration as the robot transports the substrate, and operating the robot to reduce vibration of the end effector supporting the substrate. In some embodiments, a filter is provided in the motor drive circuit to filter one or more frequencies causing unwanted vibration of the end effector. Vibration control systems and methods of operating the same are provided, as are other aspects.