公开(公告)号：US11551942B2

公开(公告)日：2023-01-10

申请号：US17022072

申请日：2020-09-15

Applicant: APPLIED MATERIALS, INC.

Inventor： Manoj A. Gajendra ,  Kyle Moran Hanson ,  Mahadev Joshi ,  Arvind Thiyagarajan ,  Jon Christian Farr

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/3065 ,  B08B3/08 ,  H01L21/677 ,  H01L21/687

Abstract: Methods and apparatus for removing substrate contamination are provided herein. In some embodiments, a multi-chamber processing apparatus includes: a processing chamber for processing a substrate; a factory interface (FI) coupled to the processing chamber via a load lock chamber disposed therebetween; and a cleaning chamber coupled to the FI and configured to rinse and to dry the substrate, wherein the cleaning chamber includes a chamber body defining an interior volume and having a first opening at an interface with the FI for transferring the substrate into and out of the interior volume.