公开(公告)号：US20170365492A1

公开(公告)日：2017-12-21

申请号：US15604312

申请日：2017-05-24

Applicant: APPLIED Materials, Inc.

Inventor： Kyle Moran Hanson ,  Paul R. McHugh

IPC: H01L21/67 ,  B08B3/08 ,  H01L21/02 ,  H01L21/687 ,  B08B3/04

CPC classification number: H01L21/67051 ,  B08B3/042 ,  B08B3/08 ,  H01L21/02041 ,  H01L21/67057 ,  H01L21/67126 ,  H01L21/6719 ,  H01L21/68764 ,  H01L21/68771 ,  H01L21/68785 ,  H01L21/68792

Abstract: A processing system includes at least one processor having a tank for holding a process liquid. A clean assembly above the tank is provided with an upper housing having at least one upper housing spray nozzle, and a lower housing having at least one lower housing spray nozzle, with the lower housing below the upper housing. A door between the upper housing and the lower housing is movable via an actuator from an open position wherein a load port through the clean assembly is open, to a closed position wherein the load port is closed off. The door largely prevents liquids used in the upper housing from moving down into the process liquid in the tank, and may also improve gas flow in the system.

公开(公告)号：US20170051423A1

公开(公告)日：2017-02-23

申请号：US15232970

申请日：2016-08-10

Applicant: APPLIED Materials, Inc.

Inventor： Paul Van Valkenburg ,  Robert Mikkola ,  John L. Klocke ,  Paul R. McHugh ,  Gregory J. Wilson ,  Kyle Moran Hanson ,  Eric J. Bergman

IPC: C25D5/02 ,  C25D21/10 ,  C25D17/06 ,  C25D17/00 ,  C25D5/22

CPC classification number: C25D21/10 ,  C25D5/02 ,  C25D7/12 ,  C25D17/001 ,  C25D17/002 ,  C25D17/008 ,  C25D17/06

Abstract: In electroplating apparatus, a paddle or agitator agitates electrolyte in a vessel to provide high velocity fluid flow at the surface of a wafer. The agitator is designed and/or moved to also selectively shield part of the wafer, for example the edge of the wafer, from the electric field in the vessel. Selectively shielding may be achieved by temporally shifting the average position of the agitator towards one side of the wafer, by omitting or shortening slots in the agitator, and/or by synchronizing movement of the agitator with rotation of the wafer.

Abstract translation: 在电镀装置中，桨或搅拌器搅动容器中的电解质以在晶片的表面提供高速流体流动。 搅拌器被设计和/或移动以也可以选择性地将晶片的一部分（例如晶片的边缘）从容器中的电场屏蔽。 通过省略或缩短搅拌器中的狭缝，和/或通过使搅拌器与晶片的旋转同步移动，可以将搅拌器的平均位置暂时移向晶片的一侧来实现选择性屏蔽。

公开(公告)号：US11551942B2

公开(公告)日：2023-01-10

申请号：US17022072

申请日：2020-09-15

Applicant: APPLIED MATERIALS, INC.

Inventor： Manoj A. Gajendra ,  Kyle Moran Hanson ,  Mahadev Joshi ,  Arvind Thiyagarajan ,  Jon Christian Farr

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/3065 ,  B08B3/08 ,  H01L21/677 ,  H01L21/687

Abstract: Methods and apparatus for removing substrate contamination are provided herein. In some embodiments, a multi-chamber processing apparatus includes: a processing chamber for processing a substrate; a factory interface (FI) coupled to the processing chamber via a load lock chamber disposed therebetween; and a cleaning chamber coupled to the FI and configured to rinse and to dry the substrate, wherein the cleaning chamber includes a chamber body defining an interior volume and having a first opening at an interface with the FI for transferring the substrate into and out of the interior volume.

公开(公告)号：US20170139334A1

公开(公告)日：2017-05-18

申请号：US14945319

申请日：2015-11-18

Applicant: APPLIED Materials, Inc.

Inventor： Jason Rye ,  Kyle Moran Hanson

IPC: G03F7/20

CPC classification number: G03F7/70925 ,  B08B11/02 ,  G03F1/82 ,  G03F7/707 ,  H01L21/68728

Abstract: Apparatus for cleaning a photo mask includes a rotor in a head, with the rotor having a seal plate having a central opening, a resilient mask seal in the central opening, and retractors attached to the resilient mask seal and adapted to move the resilient mask seal into open and closed positions. A motor in the head rotates the rotor. A push plate in the head moves to operate the retractors. In the closed position the resilient mask seal seals against the sides of the photo mask. The back side of the photo mask can then be cleaned without affecting the patterned front side of the photo mask.

公开(公告)号：US10240248B2

公开(公告)日：2019-03-26

申请号：US15232970

申请日：2016-08-10

Applicant: APPLIED Materials, Inc.

Inventor： Paul Van Valkenburg ,  Robert Mikkola ,  John L. Klocke ,  Paul R. McHugh ,  Gregory J. Wilson ,  Kyle Moran Hanson ,  Eric J. Bergman

IPC: C25D17/00 ,  C25D5/02 ,  C25D7/12 ,  C25D21/10 ,  C25D17/06

Abstract: In electroplating apparatus, a paddle or agitator agitates electrolyte in a vessel to provide high velocity fluid flow at the surface of a wafer. The agitator is designed and/or moved to also selectively shield part of the wafer, for example the edge of the wafer, from the electric field in the vessel. Selectively shielding may be achieved by temporally shifting the average position of the agitator towards one side of the wafer, by omitting or shortening slots in the agitator, and/or by synchronizing movement of the agitator with rotation of the wafer.

公开(公告)号：US09864283B2

公开(公告)日：2018-01-09

申请号：US14945319

申请日：2015-11-18

Applicant: APPLIED Materials, Inc.

Inventor： Jason Rye ,  Kyle Moran Hanson

IPC: B08B11/02 ,  G03F7/20 ,  H01L21/687

CPC classification number: G03F7/70925 ,  B08B11/02 ,  G03F1/82 ,  G03F7/707 ,  H01L21/68728

Abstract: Apparatus for cleaning a photo mask includes a rotor in a head, with the rotor having a seal plate having a central opening, a resilient mask seal in the central opening, and retractors attached to the resilient mask seal and adapted to move the resilient mask seal into open and closed positions. A motor in the head rotates the rotor. A push plate in the head moves to operate the retractors. In the closed position the resilient mask seal seals against the sides of the photo mask. The back side of the photo mask can then be cleaned without affecting the patterned front side of the photo mask.

公开(公告)号：US10191379B2

公开(公告)日：2019-01-29

申请号：US15606883

申请日：2017-05-26

Applicant: APPLIED Materials, Inc.

Inventor： Paul R. McHugh ,  Kyle Moran Hanson ,  John L. Klocke ,  Eric J. Bergman ,  Stuart Crane ,  Gregory J. Wilson

IPC: G03F7/42 ,  H01L21/02 ,  G03F7/40

Abstract: In systems and methods for removing a photoresist film off of a wafer, the wafer is moved into a bath of a process liquid in a process tank. The process liquid removes the photoresist film from the wafer. The process liquid is pumped from the process tank to a filter assembly and moved through filter media to filter out solids from the process liquid, and the filtered process liquid is returned to the process tank. A scraper scrapes the filter media to prevent clogging of the filter media by accumulated solids.

公开(公告)号：US20190019688A1

公开(公告)日：2019-01-17

申请号：US16036617

申请日：2018-07-16

Applicant: Applied Materials, Inc.

Inventor： Eric J. Bergman ,  John L. Klocke ,  Charles Sharbono ,  Kyle Moran Hanson ,  Paul McHugh

IPC: H01L21/311 ,  H01L21/324 ,  H01L21/687

Abstract: Methods of etching a semiconductor substrate may include applying an etchant to the semiconductor substrate. The semiconductor substrate may include an exposed region of an oxygen-containing material and an exposed region of a nitrogen-containing material. The methods may include heating the semiconductor substrate from a first temperature to a second temperature. The methods may include maintaining the semiconductor substrate at the second temperature for a period of time sufficient to perform an etch of the nitrogen-containing material relative to the oxygen-containing material. The methods may also include quenching the etch subsequent the period of time.

公开(公告)号：US20170357158A1

公开(公告)日：2017-12-14

申请号：US15606883

申请日：2017-05-26

Applicant: APPLIED Materials, Inc.

Inventor： Paul R. McHugh ,  Kyle Moran Hanson ,  John L. Klocke ,  Eric J. Bergman ,  Stuart Crane ,  Gregory J. Wilson

IPC: G03F7/42

CPC classification number: G03F7/422 ,  G03F7/3092 ,  G03F7/40 ,  H01L21/02087

Abstract: In systems and methods for removing a photoresist film off of a wafer, the wafer is moved into a bath of a process liquid in a process tank. The process liquid removes the photoresist film from the wafer. The process liquid is pumped from the process tank to a filter assembly and moved through filter media to filter out solids from the process liquid, and the filtered process liquid is returned to the process tank. A scraper scrapes the filter media to prevent clogging of the filter media by accumulated solids.