公开(公告)号：US09883549B2

公开(公告)日：2018-01-30

申请号：US14997529

申请日：2016-01-16

Applicant: APPLIED MATERIALS, INC.

Inventor： Alexander Matyushkin ,  Dan Katz ,  John Holland ,  Theodoros Panagopoulos ,  Michael D. Willwerth

IPC: H05B3/00 ,  H01L21/67 ,  H01L21/683 ,  B05C13/00

CPC classification number: H05B3/0047 ,  B05C13/00 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/6831 ,  H01L21/6833

Abstract: A substrate support assembly comprises a ceramic puck having a substrate receiving surface and an opposing backside surface. The ceramic puck has an electrode and a heater embedded therein. The heater comprises first and second coils that are radially spaced apart. A base of the support assembly comprises a channel to circulate fluid therethrough, the channel comprising an inlet and terminus that are adjacent to one another so that the channel loops back upon itself. A compliant layer bonds the ceramic puck to the base.

公开(公告)号：US10257887B2

公开(公告)日：2019-04-09

申请号：US15840759

申请日：2017-12-13

Applicant: APPLIED MATERIALS, INC.

Inventor： Alexander Matyushkin ,  Dan Katz ,  John Holland ,  Theodoros Panagopoulos ,  Michael D. Willwerth

IPC: B05C13/00 ,  H05B3/00 ,  H01L21/67 ,  H01L21/683

Abstract: A substrate support assembly comprises a ceramic puck comprising a substrate receiving surface, and having embedded therein: (i) an electrode to generate an electrostatic force to retain a substrate placed on the substrate receiving surface; and (ii) a heater to heat the substrate, the heater comprising a plurality of spaced apart heater coils. A compliant layer bonds the ceramic puck to a base, the compliant layer comprising a silicon material. The base comprises a channel to circulate fluid therethrough, the channel having a channel inlet and a channel terminus.