公开(公告)号：US10431435B2

公开(公告)日：2019-10-01

申请号：US14614199

申请日：2015-02-04

Applicant: APPLIED MATERIALS, INC.

Inventor： Dmitry Lubomirsky ,  Son T. Nguyen ,  Anh N. Nguyen ,  David Palagashvill

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/687

Abstract: A wafer carrier is described with independent isolated heater zones. In one example, the carrier has a puck to carry a workpiece for fabrication processes, a heater plate having a plurality of thermally isolated blocks each thermally coupled to the puck, and each having a heater to heat a respective block of the heater plate, and a cooling plate fastened to and thermally coupled to the heater plate, the cooling plate having a cooling channel to carry a heat transfer fluid to transfer heat from the cooling plate.