公开(公告)号：US11450539B2

公开(公告)日：2022-09-20

申请号：US16112197

申请日：2018-08-24

Applicant: Applied Materials, Inc.

Inventor： Sushant S. Koshti ,  Dean C. Hruzek ,  Ayan Majumdar ,  John C. Menk ,  Helder T. Lee ,  Sangram Patil ,  Sanjay Rajaram ,  Douglas B. Baumgarten ,  Nir Merry

IPC: H01L21/67 ,  H01L21/677

Abstract: Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.

公开(公告)号：US20220285193A1

公开(公告)日：2022-09-08

申请号：US17683938

申请日：2022-03-01

Applicant: APPLIED MATERIALS, INC.

Inventor： Srinivas Poshatrahalli Gopalakrishna ,  Paul B. Reuter ,  Devendra Channappa Holeyannavar ,  Douglas B. Baumgarten ,  Sushant S. Koshti ,  Arunkumar Ramachandraiah ,  Narayanan Ramachandran

IPC: H01L21/677 ,  B25J9/16

Abstract: The disclosure describes devices, systems, and methods for integrating load locks into a factory interface footprint space. A factory interface for an electronic device manufacturing system can include a load port for receiving a substrate carrier. The load port can include a frame adapted for connecting the load port to a factory interface, the frame comprising a transport opening through which one or more substrates are capable of being transported between the substrate carrier and the factory interface. The load port can also include an actuator coupled to the frame, and a load port door coupled to the actuator and configured to seal the transport opening. The frame height can be greater than the height of the load port door, and less than 2.5 times the height of the load port door.

公开(公告)号：US11640915B2

公开(公告)日：2023-05-02

申请号：US17532954

申请日：2021-11-22

Applicant: APPLIED MATERIALS, INC.

Inventor： Paul B. Reuter ,  Dean C. Hruzek ,  Nir Merry ,  John C. Menk ,  Douglas B. Baumgarten

IPC: H01L21/673 ,  H01L21/677 ,  H01L21/67

Abstract: Electronic device processing systems including an equipment front end module (EFEM) with a side storage pod are described. The EFEM includes an EFEM chamber and a recirculation duct. The side storage pod is fluidly coupled to the recirculation duct. The side storage pod includes an interior chamber and a side storage container disposed within the interior chamber. The side storage container is configured to receive one or more substrates from the EFEM chamber. The electronic device processing system further includes an environmental control system. The environmental control system is configured to circulate a purge gas between the EFEM chamber and the side storage pod via the recirculation duct.

公开(公告)号：US10541165B2

公开(公告)日：2020-01-21

申请号：US15348964

申请日：2016-11-10

Applicant: Applied Materials, Inc.

Inventor： Paul B. Reuter ,  Douglas B. Baumgarten

IPC: H01L21/673

Abstract: Embodiments provide systems, apparatus, and methods for an improved load port that includes a backplane assembly supporting a docking tray and a substrate carrier opener, wherein the backplane assembly includes a backplane; a leveling block coupleable to an equipment front end module (EFEM); a conical hole adjustment assembly coupled between the leveling block and the backplane; and a slotted hole adjustment assembly coupled between the leveling block and the backplane. The conical hole adjustment assembly includes a conical hole block coupled to the leveling block at a first end; a threaded block coupled to the backplane; and an adjustment bolt coupled to the conical hole block and the threaded block. Numerous additional aspects are disclosed.

公开(公告)号：US10453726B2

公开(公告)日：2019-10-22

申请号：US15348947

申请日：2016-11-10

Applicant: Applied Materials, Inc.

Inventor： David T. Blahnik ,  Paul B. Reuter ,  Luke W. Bonecutter ,  Douglas B. Baumgarten

IPC: H01L21/677 ,  H01L21/67

Abstract: An electronic device manufacturing system includes a factory interface that has a load port. The load port may include a panel having an opening therein and a carrier door opener that seals the opening when the door is closed. The carrier door opener may have a groove along an outer portion of the door. The groove may have a cross-sectional shape of a triangular prism frustum. A hollow O-ring may be seated in the groove and is configured to engage the panel when the carrier door opener is closed against the panel. Methods of assembling a factory interface for an electronic device manufacturing system are also provided, as are other aspects.

公开(公告)号：US12159802B2

公开(公告)日：2024-12-03

申请号：US17683938

申请日：2022-03-01

Applicant: APPLIED MATERIALS, INC.

Inventor： Srinivas Poshatrahalli Gopalakrishna ,  Paul B. Reuter ,  Devendra Channappa Holeyannavar ,  Douglas B. Baumgarten ,  Sushant S. Koshti ,  Arunkumar Ramachandraiah ,  Narayanan Ramachandran

IPC: H01L21/677 ,  B25J9/16

Abstract: The disclosure describes devices, systems, and methods for integrating load locks into a factory interface footprint space. A factory interface for an electronic device manufacturing system can include a load port for receiving a substrate carrier. The load port can include a frame adapted for connecting the load port to a factory interface, the frame comprising a transport opening through which one or more substrates are capable of being transported between the substrate carrier and the factory interface. The load port can also include an actuator coupled to the frame, and a load port door coupled to the actuator and configured to seal the transport opening. The frame height can be greater than the height of the load port door, and less than 2.5 times the height of the load port door.

公开(公告)号：US11610794B2

公开(公告)日：2023-03-21

申请号：US16656191

申请日：2019-10-17

Applicant: APPLIED MATERIALS, INC.

Inventor： Paul Reuter ,  Dean C. Hruzek ,  Nir Merry ,  John C. Menk ,  Douglas B. Baumgarten

IPC: H01L21/673 ,  H01L21/67 ,  B01D53/04

Abstract: Electronic device processing assemblies including an equipment front end module (EFEM) with at least one side storage pod attached thereto are described. The side storage pod has a side storage container. In some embodiments, an exhaust conduit extends between the chamber and a pod plenum that can contain a chemical filter proximate thereto. A supplemental fan may draw purge gas from the pod plenum through the chemical filter and route the gas through a return duct to an upper plenum of the EFEM. Methods and side storage pods in accordance with these and other embodiments are also disclosed.

公开(公告)号：US20220084860A1

公开(公告)日：2022-03-17

申请号：US17532954

申请日：2021-11-22

Applicant: APPLIED MATERIALS, INC.

Inventor： Paul B. Reuter ,  Dean C. Hruzek ,  Nir Merry ,  John C. Menk ,  Douglas B. Baumgarten

IPC: H01L21/673 ,  H01L21/677 ,  H01L21/67

Abstract: Electronic device processing systems including an equipment front end module (EFEM) with a side storage pod are described. The EFEM includes an EFEM chamber and a recirculation duct. The side storage pod is fluidly coupled to the recirculation duct. The side storage pod includes an interior chamber and a side storage container disposed within the interior chamber. The side storage container is configured to receive one or more substrates from the EFEM chamber. The electronic device processing system further includes an environmental control system. The environmental control system is configured to circulate a purge gas between the EFEM chamber and the side storage pod via the recirculation duct.

公开(公告)号：US11171029B2

公开(公告)日：2021-11-09

申请号：US16600241

申请日：2019-10-11

Applicant: Applied Materials, Inc.

Inventor： David T. Blahnik ,  Paul B. Reuter ,  Luke W. Bonecutter ,  Douglas B. Baumgarten

IPC: H01L21/677 ,  H01L21/67

Abstract: A carrier door opener includes one or more connector devices configured to interface with a door of a substrate carrier located at a load port. The carrier door opener further includes an outer surface forming a groove and a load port seal seated in the groove. The load port seal is configured to seal against a first portion of a planar surface of a panel of the load port around a panel opening formed by the panel. A second portion of the planar surface of the panel is configured to seal to a factory interface.

公开(公告)号：US20200043770A1

公开(公告)日：2020-02-06

申请号：US16600241

申请日：2019-10-11

Applicant: Applied Materials, Inc.

Inventor： David T. Blahnik ,  Paul B. Reuter ,  Luke W. Bonecutter ,  Douglas B. Baumgarten

IPC: H01L21/677 ,  H01L21/67

Abstract: A carrier door opener includes one or more connector devices configured to interface with a door of a substrate carrier located at a load port. The carrier door opener further includes an outer surface forming a groove and a load port seal seated in the groove. The load port seal is configured to seal against a first portion of a planar surface of a panel of the load port around a panel opening formed by the panel. A second portion of the planar surface of the panel is configured to seal to a factory interface.