公开(公告)号：US20160322234A1

公开(公告)日：2016-11-03

申请号：US15142220

申请日：2016-04-29

Applicant: APPLIED MATERIALS, INC.

Inventor： Jen Sern LEW ,  Tuck Foong KOH ,  Sriskantharajah THIRUNAVUKARASU ,  Karthik ELUMALAI ,  ENG SHENG PEH ,  JUN-LIANG SU

IPC: H01L21/324 ,  F27B9/02 ,  F27B9/10 ,  H01L21/67

CPC classification number: H01L21/3247 ,  F27B9/02 ,  F27B9/10 ,  F27B17/0025 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/67288

Abstract: Embodiments of methods and apparatus for correcting substrate deformity are provided herein. In some embodiments, a substrate flattening system includes: a first process chamber having a first substrate support and a first showerhead, wherein the first substrate support does not include a chucking mechanism; a first heater disposed in the first substrate support to heat a substrate placed on a first support surface of the first substrate support; a second heater configured to heat a process gas flowing through the first showerhead into a first processing volume of the first process chamber; and a second process chamber having a second substrate support, wherein the second substrate support is not heated, and wherein the first process chamber and the cooling chamber are both non-vacuum chambers.

Abstract translation: 本文提供了用于校正衬底畸形的方法和装置的实施例。 在一些实施例中，衬底平坦化系统包括：具有第一衬底支撑件和第一喷头的第一处理室，其中所述第一衬底支撑件不包括夹紧机构; 第一加热器，设置在所述第一基板支撑件中以加热放置在所述第一基板支撑件的第一支撑表面上的基板; 第二加热器，被配置为将流过所述第一喷淋头的处理气体加热到所述第一处理室的第一处理容积中; 以及具有第二基板支撑件的第二处理室，其中所述第二基板支撑件不被加热，并且其中所述第一处理室和所述冷却室都是非真空室。