公开(公告)号：US20140262043A1

公开(公告)日：2014-09-18

申请号：US13798028

申请日：2013-03-12

Applicant: APPLIED MATERIALS, INC.

Inventor： LARRY FRAZIER ,  CHENG-HSIUNG MATTHEW TSAI ,  JOHN C. FORSTER ,  MEI PO YEUNG ,  MICHAEL S. JACKSON

IPC: H01L21/683

Abstract: Methods and apparatus for processing substrates are disclosed herein. In some embodiments, a substrate support to support a substrate in a processing chamber includes a dielectric insulator plate; a conductive plate supported on the dielectric insulator plate, the conductive plate comprising a top surface and a bottom surface defining a thickness between the top surface and the bottom surface, wherein an edge portion of the conductive plate tapers in a radially outward direction; and a dielectric plate comprising a substrate support surface disposed upon the top surface of the conductor plate.

Abstract translation: 本文公开了处理衬底的方法和设备。 在一些实施例中，用于在处理室中支撑衬底的衬底支撑件包括介电绝缘板; 所述导电板包括顶表面和底表面，所述导电板限定所述顶表面和所述底表面之间的厚度，其中所述导电板的边缘部分在径向向外的方向上逐渐变细; 以及电介质板，其包括设置在所述导体板的顶表面上的衬底支撑表面。

公开(公告)号：US20190326114A1

公开(公告)日：2019-10-24

申请号：US16381755

申请日：2019-04-11

Applicant: APPLIED MATERIALS, INC.

Inventor： JESSICA S. KACHIAN ,  JUKKA TANSKANEN ,  WENYU ZHANG ,  MICHAEL S. JACKSON ,  CHANG KE ,  LIQI WU

IPC: H01L21/02 ,  C23C16/458

Abstract: Methods for treating a substrate including: contacting a substrate having a top surface with a first self-assembled monolayer (SAM) precursor or a first small-molecule monolayer (SMM) precursor, a co-reactant, and a second SAM precursor or a second SMM precursor to form a first layer on the top surface. Selective deposition methods are also disclosed.