公开(公告)号：US20150348823A1

公开(公告)日：2015-12-03

申请号：US14450241

申请日：2014-08-02

Applicant: APPLIED MATERIALS, INC.

Inventor： BONNIE T. CHIA ,  JALLEPALLY RAVI ,  MANJUNATHA KOPPA ,  VINOD KONDA PURATHE ,  CHENG-HSIUNG MATTHEW TSAI ,  ARAVIND MIYAR KAMATH

IPC: H01L21/687

Abstract: Embodiments of lift pin assemblies are provided herein. In some embodiments, a lift pin assembly includes an elongate base formed of a first material and having a first feature formed in a distal end of the base to interface with and removably support a tip; and a tip formed of a second material different than the first material and having a support surface on a first side of the tip and an opposing second side of the tip, wherein the opposing second side includes a second feature to mate with the first feature of the base to removably retain the tip on the distal end of the base.

Abstract translation: 本文提供了提升销组件的实施例。 在一些实施例中，提升销组件包括由第一材料形成的细长基部，并且具有形成在基部的远端中的第一特征以与尖端相接合并可拆卸地支撑尖端; 以及由与所述第一材料不同的第二材料形成的尖端，并且在所述尖端的第一侧上具有支撑表面和所述尖端的相对的第二侧，其中所述相对的第二侧包括与所述第一特征相配合的第二特征 基部可移除地将尖端保持在基部的远端上。

公开(公告)号：US20140196848A1

公开(公告)日：2014-07-17

申请号：US13742692

申请日：2013-01-16

Applicant: APPLIED MATERIALS, INC.

Inventor： BONNIE T. CHIA ,  SONG-MOON SUH ,  CHENG-HSIUNG MATTHEW TSAI ,  ROBERT DINSMORE ,  GLEN T. MORI

IPC: B05C21/00

CPC classification number: H01J37/32715 ,  C23C14/564 ,  H01J37/32477 ,  H01J37/32853 ,  H01J37/3405 ,  H01J37/3417 ,  H01J37/3423 ,  H01J37/3447

Abstract: Shutter disks for use in process chambers are provided herein. In some embodiments, a shutter disk for use in a process chamber may include a body having an outer perimeter, a top surface of the body, wherein the top surface includes a central portion having a substantially horizontal planar surface, and at least one angled structure disposed radially outward of the central portion, each of the at least one angled structure having a top portion and an angled surface disposed at a downward angle in a radially outward direction from the top portion toward the outer perimeter, and a bottom surface of the body.

Abstract translation: 本文提供了用于处理室的快门盘。 在一些实施例中，用于处理室的快门盘可以包括具有外周边，主体顶表面的主体，其中顶表面包括具有基本上水平的平面表面的中心部分，以及至少一个倾斜结构 设置在所述中心部分的径向外侧，所述至少一个倾斜结构中的每一个具有顶部和从所述顶部朝向所述外周边沿径向向外的方向以向下的角度设置的成角度的表面，以及所述主体的底表面 。

公开(公告)号：US20130088808A1

公开(公告)日：2013-04-11

申请号：US13630136

申请日：2012-09-28

Applicant: APPLIED MATERIALS, INC.

Inventor： VIJAY D. PARKHE ,  STEVEN V. SANSONI ,  CHENG-HSIUNG MATTHEW TSAI

IPC: H02N13/00

CPC classification number: H02N13/00 ,  H01L21/6833

Abstract: Embodiments of electrostatic chucks are provided herein. In some embodiments, an electrostatic chuck for retaining a substrate includes a base plate, a ceramic plate, supported by the base plate, having a substrate supporting surface, a first plurality of electrodes disposed within the ceramic plate having a first polarity, and a second plurality of electrodes disposed within the ceramic plate have a second polarity opposite from the first polarity, wherein the first and second plurality of electrodes are independently controllable to provide a desired chucking power and frequency.

Abstract translation: 本文提供了静电卡盘的实施例。 在一些实施例中，用于保持基板的静电卡盘包括基板，由基板支撑的陶瓷板，具有基板支撑表面，设置在具有第一极性的陶瓷板内的第一多个电极， 设置在陶瓷板内的多个电极具有与第一极性相反的第二极性，其中第一和第二多个电极是独立可控的以提供期望的夹持功率和频率。

公开(公告)号：US20160002778A1

公开(公告)日：2016-01-07

申请号：US14476238

申请日：2014-09-03

Applicant: APPLIED MATERIALS, INC.

Inventor： JALLEPALLY RAVI ,  TOMOHARU MATSUSHITA ,  ARAVIND MIYAR KAMATH ,  XIAOXIONG YUAN ,  CHENG-HSIUNG MATTHEW TSAI ,  MANJUNATHA KOPPA

IPC: C23C16/458 ,  C23C16/455 ,  C23C16/46

CPC classification number: C23C16/455 ,  C23C16/4586

Abstract: Embodiments of substrate supports are provided herein. In some embodiments, a substrate support may include a first plate for supporting a substrate, the first plate having a plurality of purge gas channels on its backside; a second plate disposed beneath and supporting the first plate; and an edge ring surrounding the first plate and disposed above the second plate, wherein the plurality of purge gas channels extend from a single inlet in a central portion to a plurality of outlets at a periphery of the first plate, and wherein the plurality of purge gas channels have a substantially equal flow conductance.

Abstract translation: 本文提供了基板支撑件的实施例。 在一些实施例中，衬底支撑件可以包括用于支撑衬底的第一板，第一板在其背面具有多个吹扫气体通道; 设置在第一板下方并支撑第一板的第二板; 以及围绕所述第一板并设置在所述第二板上方的边缘环，其中所述多个吹扫气体通道从所述第一板的周边处的中心部分中的单个入口延伸到多个出口，并且其中所述多个吹扫 气体通道具有基本相等的流动电导。

公开(公告)号：US20140262043A1

公开(公告)日：2014-09-18

申请号：US13798028

申请日：2013-03-12

Applicant: APPLIED MATERIALS, INC.

Inventor： LARRY FRAZIER ,  CHENG-HSIUNG MATTHEW TSAI ,  JOHN C. FORSTER ,  MEI PO YEUNG ,  MICHAEL S. JACKSON

IPC: H01L21/683

Abstract: Methods and apparatus for processing substrates are disclosed herein. In some embodiments, a substrate support to support a substrate in a processing chamber includes a dielectric insulator plate; a conductive plate supported on the dielectric insulator plate, the conductive plate comprising a top surface and a bottom surface defining a thickness between the top surface and the bottom surface, wherein an edge portion of the conductive plate tapers in a radially outward direction; and a dielectric plate comprising a substrate support surface disposed upon the top surface of the conductor plate.

Abstract translation: 本文公开了处理衬底的方法和设备。 在一些实施例中，用于在处理室中支撑衬底的衬底支撑件包括介电绝缘板; 所述导电板包括顶表面和底表面，所述导电板限定所述顶表面和所述底表面之间的厚度，其中所述导电板的边缘部分在径向向外的方向上逐渐变细; 以及电介质板，其包括设置在所述导体板的顶表面上的衬底支撑表面。

公开(公告)号：US20130088809A1

公开(公告)日：2013-04-11

申请号：US13630196

申请日：2012-09-28

Applicant: APPLIED MATERIALS, INC.

Inventor： VIJAY D. PARKHE ,  STEVEN V. SANSONI ,  CHENG-HSIUNG MATTHEW TSAI

IPC: F28F3/00 ,  H02N13/00

CPC classification number: F28F3/00 ,  B23Q3/15 ,  B23Q3/1543 ,  H01L21/67109 ,  H01L21/683 ,  H01L21/6831 ,  H02N13/00

Abstract: Embodiments of an apparatus for controlling a temperature of an electrostatic chuck in a process chamber are provided herein. In some embodiments, the apparatus includes an electrostatic chuck disposed in a process chamber, the electrostatic chuck including a ceramic plate having a substrate supporting surface, and a cooling assembly including a plurality of cooling plates disposed below the electrostatic chuck to adjust the cooling capacity of the electrostatic chuck. In some embodiments, the plurality of cooling plates includes an inner cooling plate configured to control a temperature of a center portion of the electrostatic chuck, and an outer cooling plate configured to control a temperature of an outer portion of the electrostatic chuck. In some embodiments, the plurality of cooling plates includes an upper cooling plate that contacts a bottom surface of the electrostatic chuck, and a lower cooling plate which contacts a bottom surface of the upper cooling plate.

Abstract translation: 本文提供了用于控制处理室中的静电卡盘的温度的装置的实施例。 在一些实施例中，该设备包括设置在处理室中的静电吸盘，静电吸盘包括具有基板支撑表面的陶瓷板，以及包括设置在静电卡盘下方的多个冷却板的冷却组件，以调节冷却能力 静电吸盘。 在一些实施例中，多个冷却板包括构造成控制静电卡盘的中心部分的温度的内部冷却板和被配置为控制静电卡盘的外部部分的温度的外部冷却板。 在一些实施例中，多个冷却板包括接触静电卡盘的底表面的上部冷却板和接触上部冷却板底面的下部冷却板。