公开(公告)号：US20150076135A1

公开(公告)日：2015-03-19

申请号：US14481283

申请日：2014-09-09

Applicant: APPLIED MATERIALS, INC.

Inventor： NIR MERRY ,  LEON VOLFOVSKI

IPC: H01L23/34 ,  H05B3/28 ,  H01L21/683

CPC classification number: H01L23/34 ,  H01L21/67103 ,  H01L21/67248 ,  H01L21/683 ,  H01L21/68792 ,  H01L2924/0002 ,  H05B3/283 ,  Y10T29/49083 ,  H01L2924/00

Abstract: Methods and apparatus of substrate supports having temperature profile control are provided herein. In some embodiments, a substrate support includes: a plate having a substrate receiving surface and an opposite bottom surface; and a shaft having a first end comprising a shaft heater and a second end, wherein the first end is coupled to the bottom surface. Methods of making a substrate support having temperature profile control are also provided.

Abstract translation: 本文提供了具有温度分布控制的基板支撑件的方法和装置。 在一些实施例中，衬底支撑件包括：板，其具有衬底接收表面和相对的底表面; 以及轴，其具有包括轴加热器和第二端的第一端，其中所述第一端联接到所述底表面。 还提供了制造具有温度分布控制的基板支撑件的方法。