公开(公告)号：US20210176831A1

公开(公告)日：2021-06-10

申请号：US17106735

申请日：2020-11-30

Applicant: APPLIED MATERIALS, INC.

Inventor： Pingyan LEI ,  Dien-Yeh WU ,  Jallepally RAVI ,  Manjunatha KOPPA ,  Ambarish TOORIHAL ,  Sandesh YADAMANE ,  Vinod Konda PURATHE ,  Xiaoxiong YUAN

IPC: H05B3/48 ,  C23C14/54 ,  C23C16/458 ,  C23C16/455 ,  H05B3/14

Abstract: Embodiments of a lid heater for a deposition chamber are provided herein. In some embodiments, a lid heater for a deposition chamber includes a ceramic heater body having a first side opposite a second side, wherein the ceramic heater body includes a first plurality of gas channels extending from one or more first gas inlets on the first side, wherein each of the one or more first gas inlets extend to a plurality of first gas outlets on the second side; a heating element embedded in the ceramic heater body; and an RF electrode embedded in the ceramic heater body proximate the second side, wherein the first plurality of gas channels extend through the RF electrode.

公开(公告)号：US20210130956A1

公开(公告)日：2021-05-06

申请号：US17078664

申请日：2020-10-23

Applicant: APPLIED MATERIALS, INC.

Inventor： Pingyan LEI ,  Dien-Yeh WU ,  Jallepally RAVI ,  Takashi KURATOMI ,  Xiaoxiong YUAN ,  Manjunatha KOPPA ,  Vinod Konda PURATHE

IPC: C23C16/455

Abstract: Embodiments of showerheads are provided herein. In some embodiments, a showerhead for use in a process chamber includes a gas distribution plate having an upper surface and a lower surface; a plurality of channels extending through the gas distribution plate substantially perpendicular to the lower surface; a plurality of first gas delivery holes extending from the upper surface to the lower surface between adjacent channels of the plurality of channels to deliver a first process gas through the gas distribution plate; and a plurality of second gas delivery holes extending from the plurality of channels to the lower surface to deliver a second process gas therethrough without mixing with the first process gas.

公开(公告)号：US20210032753A1

公开(公告)日：2021-02-04

申请号：US16934343

申请日：2020-07-21

Applicant: APPLIED MATERIALS, INC.

Inventor： Jallepally RAVI ,  Dien-Yeh WU ,  Pingyan LEI ,  Manjunatha P. KOPPA ,  Vinod Konda PURATHE ,  Takashi KURATOMI ,  Mei CHANG ,  Xiaoxiong YUAN

IPC: C23C16/455 ,  H01J37/32

Abstract: Methods and apparatus for gas distribution in a process chamber leverage dual electrodes to provide RF power and an RF ground return in a single showerhead. In some embodiments, the apparatus includes a showerhead composed of a non-metallic material with a first gas channel and a second gas channel, the first gas channel and the second gas channel being independent of each other, and the first gas channel including a plurality of through holes from a top surface of the showerhead to a bottom surface of the showerhead and the second gas channel including a plurality of holes on the bottom surface of the showerhead connected to one or more gas inlets on a side of the showerhead, a first electrode embedded in the showerhead near a top surface of the showerhead, and a second electrode embedded in the showerhead near a bottom surface of the showerhead.

公开(公告)号：US20210319983A1

公开(公告)日：2021-10-14

申请号：US16846295

申请日：2020-04-11

Applicant: APPLIED MATERIALS, INC.

Inventor： Pingyan LEI ,  Dien-Yeh WU ,  Xiao Ming HE ,  Jennifer Y. SUN ,  Lei ZHOU ,  Takashi KURATOMI ,  Avgerinos V. GELATOS ,  Mei CHANG ,  Steven D. MARCUS

IPC: H01J37/32 ,  H01L21/67 ,  C23C16/06 ,  C23C16/44 ,  C23C16/455

Abstract: Methods and apparatus for depositing a coating on a semiconductor manufacturing apparatus component are provided herein. In some embodiments, a method of depositing a coating on a semiconductor manufacturing apparatus component includes: sequentially exposing a semiconductor manufacturing apparatus component including nickel or nickel alloy to an aluminum precursor and a reactant to form an aluminum containing layer on a surface of the semiconductor manufacturing apparatus component by a deposition process.