公开(公告)号：US20180257116A1

公开(公告)日：2018-09-13

申请号：US15974000

申请日：2018-05-08

Applicant: APPLIED MATERIALS, INC.

Inventor： SRISKANTHARAJAH THIRUNAVUKARASU ,  JEN SERN LEW ,  ARVIND SUNDARRAJAN ,  SRINIVAS NEMANI

IPC: B08B5/02 ,  H01L21/67 ,  H01L21/683 ,  B08B6/00

CPC classification number: B08B5/02 ,  B08B6/00 ,  H01L21/67028 ,  H01L21/6831 ,  H01L21/6838

Abstract: Embodiments of methods and apparatus for removing particles from a surface of a substrate, such as from the backside of the substrate, are provided herein. In some embodiments, an apparatus for removing particles from a surface of a substrate includes: a substrate handler to expose the surface of the substrate; a particle separator to separate particles from the exposed surface of the substrate; a particle transporter to transport the separated particles; and a particle collector to collect the transported particles.