HOLISTIC ANALYSIS OF MULTIDIMENSIONAL SENSOR DATA FOR SUBSTRATE PROCESSING EQUIPMENT

    公开(公告)号:US20230367302A1

    公开(公告)日:2023-11-16

    申请号:US17742332

    申请日:2022-05-11

    IPC分类号: G05B19/418

    摘要: A method includes receiving, by a processing device, first data. The first data includes data from one or more sensors of a processing chamber and is associated with a processing operation. The first data is resolved in at least two dimensions, one of which is time. The method further includes providing the first data to a model. The method further includes receiving from the model second data. The second data includes an indication of an evolution of a processing parameter during the processing operation. The method further includes causing performance of a corrective action in view of the second data.

    TEMPERATURE-BASED METROLOGY CALIBRATION AT A MANUFACTURING SYSTEM

    公开(公告)号:US20230317481A1

    公开(公告)日:2023-10-05

    申请号:US17710779

    申请日:2022-03-31

    IPC分类号: H01L21/67 H01L21/66 G01K15/00

    摘要: Methods and systems for temperature-based metrology calibration at a manufacturing system are provided. First metrology data corresponding to one or more first temperatures associated with a substrate following a completion of one or more portions of a substrate process at a manufacturing system is obtained. Second metrology data corresponding to a second temperature associated with the substrate following the completion of the substrate process is determined in view of calibration data associated with the substrate. The second temperature is different from each of the one or more first temperatures. In response to a determination, in view of the second metrology data, that a modification criterion associated with the substrate process is satisfied, the substrate process recipe is modified.