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公开(公告)号:US11670513B2
公开(公告)日:2023-06-06
申请号:US17227327
申请日:2021-04-11
Applicant: APPLIED MATERIALS, INC.
Inventor: Yueh Sheng Ow , Junqi Wei , Wen Long Favier Shoo , Ananthkrishna Jupudi , Takashi Shimizu , Kelvin Boh , Tuck Foong Koh
IPC: H01L21/02 , H01L21/30 , H01L21/683 , H01L21/67
CPC classification number: H01L21/3003 , H01L21/67017 , H01L21/67103 , H01L21/67109 , H01L21/6831
Abstract: Methods, apparatuses, and systems for substrate processing for lowering contact resistance in at least contact pads of a semiconductor device are provided herein. In some embodiments, a method of substrate processing for lowering contact resistance of contact pads includes: circulating a cooling fluid in at least one channel of a pedestal; and exposing a backside of the substrate located on the pedestal to a cooling gas to cool a substrate located on the pedestal to a temperature of less than 70 degrees Celsius. In some embodiments in accordance with the present principles, the method can further include distributing a hydrogen gas or hydrogen gas combination over the substrate.
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2.
公开(公告)号:US11328929B2
公开(公告)日:2022-05-10
申请号:US16399478
申请日:2019-04-30
Applicant: APPLIED MATERIALS, INC.
Inventor: Yueh Sheng Ow , Junqi Wei , Wen Long Favier Shoo , Ananthkrishna Jupudi , Takashi Shimizu , Kelvin Boh , Tuck Foong Koh
IPC: H01L21/311 , H01L21/30 , H01L21/683 , H01L21/67
Abstract: Methods, apparatuses, and systems for substrate processing for lowering contact resistance in at least contact pads of a semiconductor device are provided herein. In some embodiments, a method of substrate processing for lowering contact resistance of contact pads includes: circulating a cooling fluid in at least one channel of a pedestal; and exposing a backside of the substrate located on the pedestal to a cooling gas to cool a substrate located on the pedestal to a temperature of less than 70 degrees Celsius. In some embodiments in accordance with the present principles, the method can further include distributing a hydrogen gas or hydrogen gas combination over the substrate.
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