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公开(公告)号:US20230222264A1
公开(公告)日:2023-07-13
申请号:US17571370
申请日:2022-01-07
Applicant: APPLIED MATERIALS, INC.
Inventor: Rohit Mahakali , Elizabeth Kathryn Neville , Adolph Miller Allen , Xiaoxiong Yuan , Weize Hu , Karthik Ramanathan
CPC classification number: G06F30/27 , H01L21/67276 , H01L21/67155 , H01L21/67248
Abstract: A method includes receiving, from sensors, sensor data associated with processing a substrate via a processing chamber of substrate processing equipment. The sensor data includes a first subset received from one or more first sensors and a second subset received from one or more second sensors, the first subset being mapped to the second subset. The method further includes identifying model input data and model output data. The model output data is output from a physics-based model based on model input data. The method further includes training a machine learning model with data input including the first subset and the model input data, and target output data including the second subset and the model output data to tune calibration parameters of the machine learning model. The calibration parameters are to be used by the physics-based model to perform corrective actions associated with the processing chamber.
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公开(公告)号:US20230121513A1
公开(公告)日:2023-04-20
申请号:US18068469
申请日:2022-12-19
Applicant: APPLIED MATERIALS, INC.
Inventor: Kartik B. Shah , Satish Radhakrishnan , Karthik Ramanathan , Karthikeyan Balaraman , Adolph Miller Allen , Xinyuan Chong , Mitrabhanu Sahu , Wenjing Xu , Michael Sterling Jackson , Weize Hu , Feng Chen
Abstract: Process recipe data associated a process to be performed for a substrate at a process chamber is provided as input to a trained machine learning model. A set of process recipe settings for the process that minimizes scratching on one or more surfaces of the substrate is determined based on one or more outputs of the machine learning model. The process is performed for the substrate at the process chamber in accordance with the determined set of process recipe settings.
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公开(公告)号:US11586160B2
公开(公告)日:2023-02-21
申请号:US17360652
申请日:2021-06-28
Applicant: APPLIED MATERIALS, INC.
Inventor: Kartik B Shah , Satish Radhakrishnan , Karthik Ramanathan , Karthikeyan Balaraman , Adolph Miller Allen , Xinyuan Chong , Mitrabhanu Sahu , Wenjing Xu , Michael Sterling Jackson , Weize Hu , Feng Chen
Abstract: Methods and systems for reducing substrate particle scratching using machine learning are provided. A machine learning model is trained to predict process recipe settings for a substrate temperature control process to be performed for a current substrate at a manufacturing system. First training data and second training data are generated for the machine learning model. The first training data includes historical data associated with prior process recipe settings for a prior substrate temperature control process performed for a prior substrate at a prior process chamber. The second training data is associated with a historical scratch profile of one or more surfaces of the prior substrate after performance of the prior substrate temperature control process according to the prior process recipe settings. The first training data and the second training data are provided to train the machine learning model to predict which process recipe settings for the substrate temperature control process to be performed for the current substrate correspond to a target scratch profile for one or more surfaces of the current substrate.
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公开(公告)号:US11835927B2
公开(公告)日:2023-12-05
申请号:US18068469
申请日:2022-12-19
Applicant: APPLIED MATERIALS, INC.
Inventor: Kartik B Shah , Satish Radhakrishnan , Karthik Ramanathan , Karthikeyan Balaraman , Adolph Miller Allen , Xinyuan Chong , Mitrabhanu Sahu , Wenjing Xu , Michael Sterling Jackson , Weize Hu , Feng Chen
CPC classification number: G05B13/0265 , G05B13/048
Abstract: Process recipe data associated a process to be performed for a substrate at a process chamber is provided as input to a trained machine learning model. A set of process recipe settings for the process that minimizes scratching on one or more surfaces of the substrate is determined based on one or more outputs of the machine learning model. The process is performed for the substrate at the process chamber in accordance with the determined set of process recipe settings.
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公开(公告)号:US11718912B2
公开(公告)日:2023-08-08
申请号:US16932107
申请日:2020-07-17
Applicant: APPLIED MATERIALS, INC.
Inventor: Sarah L. White , Elaina Noelle Babayan , Weize Hu
IPC: C23C16/455
CPC classification number: C23C16/45557 , C23C16/45544 , C23C16/45561
Abstract: Methods and apparatus for controlling precursor flow are provided. In embodiments, the methods and apparatus apparatus for controlling precursor flow to a deposition chamber, includes: an ampoule to output a precursor; a sensor assembly communicatively coupled to the ampoule; and a control system, wherein the control system is configured to calibrate the sensor assembly during flow of a precursor or a chemical standard through the sensor assembly.
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公开(公告)号:US11668007B2
公开(公告)日:2023-06-06
申请号:US16932107
申请日:2020-07-17
Applicant: APPLIED MATERIALS, INC.
Inventor: Sarah L. White , Elaina Noelle Babayan , Weize Hu
IPC: C23C16/455
CPC classification number: C23C16/45557 , C23C16/45544 , C23C16/45561
Abstract: Methods and apparatus for controlling precursor flow are provided. In embodiments, the methods and apparatus apparatus for controlling precursor flow to a deposition chamber, includes: an ampoule to output a precursor; a sensor assembly communicatively coupled to the ampoule; and a control system, wherein the control system is configured to calibrate the sensor assembly during flow of a precursor or a chemical standard through the sensor assembly.
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公开(公告)号:US20220413452A1
公开(公告)日:2022-12-29
申请号:US17360652
申请日:2021-06-28
Applicant: APPLIED MATERIALS, INC.
Inventor: Kartik B. Shah , Satish Radhakrishnan , Karthik Ramanathan , Karthikeyan Balaraman , Adolph Miller Allen , Xinyuan Chong , Mitrabhanu Sahu , Wenjing Xu , Michael Sterling Jackson , Weize Hu , Feng Chen
Abstract: Methods and systems for reducing substrate particle scratching using machine learning are provided. A machine learning model is trained to predict process recipe settings for a substrate temperature control process to be performed for a current substrate at a manufacturing system. First training data and second training data are generated for the machine learning model. The first training data includes historical data associated with prior process recipe settings for a prior substrate temperature control process performed for a prior substrate at a prior process chamber. The second training data is associated with a historical scratch profile of one or more surfaces of the prior substrate after performance of the prior substrate temperature control process according to the prior process recipe settings. The first training data and the second training data are provided to train the machine learning model to predict which process recipe settings for the substrate temperature control process to be performed for the current substrate correspond to a target scratch profile for one or more surfaces of the current substrate.
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