SUBSTRATE PLACEMENT DETECTION IN SEMICONDUCTOR EQUIPMENT USING THERMAL RESPONSE CHARACTERISTICS
    1.
    发明申请
    SUBSTRATE PLACEMENT DETECTION IN SEMICONDUCTOR EQUIPMENT USING THERMAL RESPONSE CHARACTERISTICS 有权
    使用热响应特性的半导体器件中的衬底放置检测

    公开(公告)号:US20150063405A1

    公开(公告)日:2015-03-05

    申请号:US14470236

    申请日:2014-08-27

    CPC classification number: G01B21/00 H01L21/67259

    Abstract: Methods and apparatus for determining proper placement of a substrate upon a substrate support in a process chamber are disclosed. In some embodiments, a method for detecting substrate placement in a process chamber includes placing a substrate on a support surface of a substrate support with the process chamber; modifying a pressure within the chamber to create a detection pressure within the chamber; sensing a first temperature of the substrate support; monitoring a thermal response characteristic of the substrate support after placing the substrate on the substrate support; comparing the thermal response characteristic to a predetermined response characteristic; and determining whether the substrate is placed correctly based upon the comparison of the thermal response characteristic to the predetermined response characteristic.

    Abstract translation: 公开了用于确定基板在处理室中的基板支撑件上的适当放置的方法和装置。 在一些实施例中,用于检测处理室中的衬底放置的方法包括:将衬底放置在处理室的衬底支撑件的支撑表面上; 修改腔室内的压力以在腔室内产生检测压力; 感测所述衬底支撑件的第一温度; 在将衬底放置在衬底支架上之后监测衬底支撑件的热响应特性; 将热响应特性与预定响应特性进行比较; 以及基于热响应特性与预定响应特性的比较来确定衬底是否被正确放置。

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