公开(公告)号：US10704142B2

公开(公告)日：2020-07-07

申请号：US15661441

申请日：2017-07-27

Applicant: APPLIED MATERIALS, INC.

Inventor： Muhannad Mustafa ,  Muhammad M. Rasheed ,  Mario Dan Sanchez ,  Yu Chang ,  William Kuang ,  Vinod Konda Purathe ,  Manjunatha Koppa

IPC: C23C16/455 ,  G01K7/16 ,  C23C16/46 ,  G01K13/08 ,  G01K1/14 ,  C23C16/458

Abstract: Embodiments of the present disclosure are directed to a quick disconnect resistance temperature detector (RTD) heater assembly, that includes a first assembly comprising a pedestal, a pedestal shaft, an adapter, one or more heater power supply terminals, and at least one RTD, and a second assembly comprising a rotating module having a central opening, and a cable assembly partially disposed in the central opening and securely fastened to the rotating module, wherein the first assembly is removably coupled to the second assembly, wherein the cable assembly includes one or more power supply sockets that receive the heater power supply terminals when the first and second assemblies are coupled together, and wherein the cable assembly includes one or more spring loaded RTD pins that contact the at least one RTD disposed in the first assembly when the first and second assemblies are coupled together.

公开(公告)号：US10407771B2

公开(公告)日：2019-09-10

申请号：US14507780

申请日：2014-10-06

Applicant: APPLIED MATERIALS, INC.

Inventor： Anqing Cui ,  Faruk Gungor ,  Dien-Yeh Wu ,  Vikas Jangra ,  Muhammad M. Rasheed ,  Wei V. Tang ,  Yixiong Yang ,  Xiaoxiong Yuan ,  Kyoung-Ho Bu ,  Srinivas Gandikota ,  Yu Chang ,  William W. Kuang

IPC: C23C16/40 ,  C23C16/44 ,  C23C16/455 ,  H01J37/32 ,  C23C16/452

Abstract: Methods and apparatus for cleaning an atomic layer deposition chamber are provided herein. In some embodiments, a chamber lid assembly includes: a housing enclosing a central channel that extends along a central axis and has an upper portion and a lower portion; a lid plate coupled to the housing and having a contoured bottom surface that extends downwardly and outwardly from a central opening coupled to the lower portion of the central channel to a peripheral portion of the lid plate; a first heating element to heat the central channel; a second heating element to heat the bottom surface of the lid plate; a remote plasma source fluidly coupled to the central channel; and an isolation collar coupled between the remote plasma source and the housing, wherein the isolation collar has an inner channel extending through the isolation collar to fluidly couple the remote plasma source and the central channel.

公开(公告)号：US11598003B2

公开(公告)日：2023-03-07

申请号：US15702234

申请日：2017-09-12

Applicant: APPLIED MATERIALS, INC.

Inventor： Faruk Gungor ,  Dien-Yeh Wu ,  Joel M. Huston ,  Mei Chang ,  Xiaoxiong Yuan ,  Kazuya Daito ,  Avgerinos V. Gelatos ,  Takashi Kuratomi ,  Yu Chang ,  Bin Cao

IPC: C23C16/455 ,  C23C16/505 ,  C23C16/46 ,  C23C16/458

Abstract: Apparatus for processing a substrate are provided herein. In some embodiments a showerhead assembly includes a gas distribution plate having a plurality of apertures; a holder having a wall, an radially inwardly extending flange extending from a lower portion of the wall and coupled to the gas distribution plate, and a radially outwardly extending flange extending from an upper portion of the wall, wherein the wall has a thickness between about 0.015 inches and about 0.2 inches; and a heating apparatus disposed above and spaced apart from the gas distribution plate, wherein the heating apparatus includes a heater configured to heat the gas distribution plate.

公开(公告)号：US11495932B2

公开(公告)日：2022-11-08

申请号：US16001243

申请日：2018-06-06

Applicant: APPLIED MATERIALS, INC.

Inventor： Muhannad Mustafa ,  Yu Chang ,  William Kuang ,  Muhammad M. Rasheed ,  Xiping Huo

IPC: H01L21/687 ,  H01R39/12 ,  H01R39/18 ,  H02K13/00 ,  H01L21/67

Abstract: Embodiments of a slip ring for use in a rotatable substrate support are provided herein. In some embodiments a slip ring includes a main body having a top wall, a bottom wall, and a sidewall extending between the top and bottom walls, wherein the top wall, bottom wall, and sidewall define an inner volume within the main body, wherein a central opening is formed through the top wall; a plurality of annular containers disposed within the inner volume and coaxially with the main body, wherein the plurality of annular containers are vertically spaced apart from one another, and wherein each of the plurality of annular containers contains a first volume of an electrically conductive liquid; an upper cylindrical body rotatably disposed in the central opening; a lower cylindrical body fixedly coupled to the lower wall of the main body.

公开(公告)号：US20180358768A1

公开(公告)日：2018-12-13

申请号：US16001243

申请日：2018-06-06

Applicant: Applied Materials, Inc.

Inventor： Muhannad Mustafa ,  Yu Chang ,  William Kuang ,  Muhammad M. Rasheed ,  Xiping Huo

IPC: H01R39/12 ,  H02K13/00 ,  H01R39/18

CPC classification number: H01R39/12 ,  H01L21/68764 ,  H01R39/18 ,  H02K13/003

Abstract: Embodiments of a slip ring for use in a rotatable substrate support are provided herein. In some embodiments a slip ring includes a main body having a top wall, a bottom wall, and a sidewall extending between the top and bottom walls, wherein the top wall, bottom wall, and sidewall define an inner volume within the main body, wherein a central opening is formed through the top wall; a plurality of annular containers disposed within the inner volume and coaxially with the main body, wherein the plurality of annular containers are vertically spaced apart from one another, and wherein each of the plurality of annular containers contains a first volume of an electrically conductive liquid; an upper cylindrical body rotatably disposed in the central opening; a lower cylindrical body fixedly coupled to the lower wall of the main body.

公开(公告)号：US10134615B2

公开(公告)日：2018-11-20

申请号：US15019573

申请日：2016-02-09

Applicant: APPLIED MATERIALS, INC.

Inventor： Aravind Miyar Kamath ,  Cheng-Hsiung Tsai ,  Jallepally Ravi ,  Tomoharu Matsushita ,  Yu Chang

IPC: H01L21/687 ,  H01L21/67 ,  H01J37/32

Abstract: Apparatus for processing a substrate are provided herein. In some embodiments, a substrate support includes a body having a support surface; an RF electrode disposed in the body proximate the support surface to receive RF current from an RF source; a shaft to support the body; a conductive element having an interior volume and extending through the shaft, wherein the conductive element is coupled to the RF electrode; and an RF gasket; wherein the conductive element includes features that engage the RF gasket to return the RF current to ground.