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公开(公告)号：US20210348296A1
公开(公告)日：2021-11-11
申请号：US16870290
申请日：2020-05-08
Applicant: APPLIED Materials, Inc.
Inventor： Paul R McHugh , Gregory J Wilson , Kyle M Hanson , John L Klocke , Paul Van Valkenburg , Eric J Bergman , Adam Marc McClure , Deepak Saagar Kalaikadal , Nolan Layne Zimmerman , Michael Windham , Mikael R Borjesson
Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.
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公开(公告)号：US11268208B2
公开(公告)日：2022-03-08
申请号：US16870290
申请日：2020-05-08
Applicant: APPLIED Materials, Inc.
Inventor： Paul R McHugh , Gregory J Wilson , Kyle M Hanson , John L Klocke , Paul Van Valkenburg , Eric J Bergman , Adam Marc McClure , Deepak Saagar Kalaikadal , Nolan Layne Zimmerman , Michael Windham , Mikael R Borjesson
Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.
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