公开(公告)号：US20180320937A1

公开(公告)日：2018-11-08

申请号：US15772397

申请日：2016-11-04

Applicant: APPOTRONICS CORPORATION LIMITED

Inventor： Gaofei DENG ,  Wei LIN ,  Jinqing LI

IPC: F25B21/02 ,  H01S3/04

CPC classification number: F25B21/02 ,  F25B2321/023 ,  F25B2321/0252 ,  H01S3/0407 ,  H05K7/20

Abstract: A TEC heat dissipation assembly includes a TEC refrigeration module, which includes a TEC refrigeration chip, a mounting plate for mounting the TEC refrigeration chip, a water cooled plate located on one side of a heat generating surface of the TEC refrigeration chip for cooling the TEC refrigeration chip, and a cover plate for covering the TEC refrigeration module and a heat source substrate. A hollowed open window which is matched with the TEC refrigeration chip in appearance and used for allowing the heat generating surface of the TEC refrigeration chip to be in contact with the water cooled plate via the mounting plate is disposed on the surface of the mounting plate. A refrigeration surface of the TEC refrigeration chip is close to the heat source substrate at the other side of the hollowed open window. Also provided is a projection device employing the TEC heat dissipation assembly.