公开(公告)号：US20190163041A1

公开(公告)日：2019-05-30

申请号：US16320960

申请日：2017-04-28

Applicant: APPOTRONICS CORPORATION LIMITED

Inventor： Gaofei DENG ,  Wei LIN ,  Tao XIE ,  Yi LI

IPC: G03B21/16 ,  G03B21/14 ,  H04N9/31

Abstract: Disclosed are a color wheel device and a projector, wherein the color wheel device comprises: a color wheel chamber used for accommodating a color wheel module and provided with an air inlet and an air outlet; a heat exchanger having a heat-exchange core, the heat-exchange core being provided with a first channel for air in the color wheel chamber passing, the air outlet of the color wheel chamber being communicated with a heat-exchange inlet of the first channel, and a heat-exchange outlet of the first channel being communicated with the air inlet of the color wheel chamber to form a closed circulating air duct, wherein the first channel has multiple layers spaced apart from one another, and the space between two adjacent layers of the first channel forms a second channel for outside air passing; and an air propulsion device used for accelerating air flow.

公开(公告)号：US20180320937A1

公开(公告)日：2018-11-08

申请号：US15772397

申请日：2016-11-04

Applicant: APPOTRONICS CORPORATION LIMITED

Inventor： Gaofei DENG ,  Wei LIN ,  Jinqing LI

IPC: F25B21/02 ,  H01S3/04

CPC classification number: F25B21/02 ,  F25B2321/023 ,  F25B2321/0252 ,  H01S3/0407 ,  H05K7/20

Abstract: A TEC heat dissipation assembly includes a TEC refrigeration module, which includes a TEC refrigeration chip, a mounting plate for mounting the TEC refrigeration chip, a water cooled plate located on one side of a heat generating surface of the TEC refrigeration chip for cooling the TEC refrigeration chip, and a cover plate for covering the TEC refrigeration module and a heat source substrate. A hollowed open window which is matched with the TEC refrigeration chip in appearance and used for allowing the heat generating surface of the TEC refrigeration chip to be in contact with the water cooled plate via the mounting plate is disposed on the surface of the mounting plate. A refrigeration surface of the TEC refrigeration chip is close to the heat source substrate at the other side of the hollowed open window. Also provided is a projection device employing the TEC heat dissipation assembly.