公开(公告)号：US20220418086A1

公开(公告)日：2022-12-29

申请号：US17701767

申请日：2022-03-23

Applicant: APTIV TECHNOLOGIES LIMITED

Inventor： Navneet GUPTA ,  Kesav Kumar SRIDHARAN ,  Scott BRANDENBURG

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K7/20

Abstract: An illustrative example embodiment of an electronic device includes an integrated circuit component having a plurality of solder balls on one side. The substrate includes a first side adjacent the one side of the integrated circuit component. The substrate includes a plurality of openings. At least some of those openings are aligned with the solder balls. A cooling plate is situated toward a second side of the substrate. A thermally conductive material within the plurality of openings is thermally coupled with the cooling plate. At least some of the thermally conductive material is thermally coupled with the solder balls.

公开(公告)号：US20240057246A1

公开(公告)日：2024-02-15

申请号：US18496854

申请日：2023-10-28

Applicant: Aptiv Technologies Limited

Inventor： Navneet GUPTA ,  Kesav Kumar SRIDHARAN ,  Scott BRANDENBURG

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K7/20

CPC classification number: H05K1/0206 ,  H05K1/181 ,  H05K1/113 ,  H05K7/20154 ,  H05K2201/10734 ,  H01L23/49816

Abstract: An illustrative example embodiment of an electronic device includes an integrated circuit component having a plurality of solder balls on one side. The substrate includes a first side adjacent the one side of the integrated circuit component. The substrate includes a plurality of openings. At least some of those openings are aligned with the solder balls. A cooling plate is situated toward a second side of the substrate. A thermally conductive material within the plurality of openings is thermally coupled with the cooling plate. At least some of the thermally conductive material is thermally coupled with the solder balls. The cooling plate comprises the thermally conductive material and the thermally conductive material within the plurality of openings forms extensions from the cooling plate.