Abstract:
The present invention relates to photopolymerizable adhesive compositions used in the encapsulation of electronic and optoelectronic devices, in particular flexible electronic and optoelectronic devices, for example photovoltaic cells, in order to protect them against gas and moisture permeation.
Abstract:
The invention relates to a process for manufacturing polyethylene or an ethylene copolymer, comprising a step of radical polymerization or copolymerization of ethylene in the presence: of a first peroxide polymerization initiator chosen from the diperketal peroxide compounds of formula: in which the R1, R2, R3, R6, R7 and R8 groups consist of substituted or unsubstituted, linear, branched or cyclic C1-C10 alkyl groups, of a second initiator, other than said first initiator, also consisting of a diperketal peroxide of formula (I).
Abstract:
The present invention relates to the use of one or more phenolic compounds, as defined below, to stabilise ethylene copolymer reactions at high pressure.The invention also relates to a method of preparing an ethylene copolymer at high pressure in the presence of one or more phenolic compounds, as defined below, and one or more initiators.
Abstract:
A process for the manufacture of copolymers of ethylene and of at least one vinyl ester, including the following steps: a) fermentation of renewable starting materials so as to produce at least one alcohol comprising ethanol; b) dehydration of the alcohol obtained so as to produce at least one alkene comprising ethylene and, optionally, purification of the alkene so as to obtain ethylene, c) copolymerization of the ethylene with at least one vinyl ester, d) isolation of the copolymer obtained. Also, the copolymers of ethylene and of at least one vinyl ester in which the ethylene is at least partly obtained from renewable starting materials, and to uses thereof.
Abstract:
The use of a polymeric composition as an encapsulant in a photovoltaic module, said polymeric composition including a copolymer that comprises an ethylene monomer and a carboxylic acid vinyl ester comonomer, in particular an ethylene vinyl acetate copolymer, and the polymeric composition having a Brookfield viscosity measured at 120° C. of between 10,000 mPa·s and 25,000 mPa·s. Further, a method for encapsulating a photovoltaic module using this polymeric composition.