METHOD FOR MANUFACTURING BENT SUBSTRATE AND BENT SUBSTRATE

    公开(公告)号:US20180327301A1

    公开(公告)日:2018-11-15

    申请号:US15977396

    申请日:2018-05-11

    CPC classification number: C03B23/0235 C03B23/0252 C03B23/0357

    Abstract: A method for manufacturing a bent substrate, which forms a bent part in at least a part of a substrate, in which the substrate includes a second region and a first region, the method for manufacturing including: supporting the first region of the substrate on a substrate support surface of a support member including a mold surface having a same curved surface shape as that of the bent part and the substrate support surface that supports the first region, in a state of facing the second region of the substrate to the mold surface; heating the second region of the substrate to soften the second region of the substrate by the heating; placing the second region along the mold surface of the support member by an own weight of the second region; and transferring the curved surface shape of the mold surface to the second region by an external force.

Patent Agency Ranking