METHOD FOR MANUFACTURING BENT SUBSTRATE AND BENT SUBSTRATE

    公开(公告)号:US20180327301A1

    公开(公告)日:2018-11-15

    申请号:US15977396

    申请日:2018-05-11

    摘要: A method for manufacturing a bent substrate, which forms a bent part in at least a part of a substrate, in which the substrate includes a second region and a first region, the method for manufacturing including: supporting the first region of the substrate on a substrate support surface of a support member including a mold surface having a same curved surface shape as that of the bent part and the substrate support surface that supports the first region, in a state of facing the second region of the substrate to the mold surface; heating the second region of the substrate to soften the second region of the substrate by the heating; placing the second region along the mold surface of the support member by an own weight of the second region; and transferring the curved surface shape of the mold surface to the second region by an external force.

    POSITIVE PRESSURE-SUPPORTED GLASS BENDING METHOD AND DEVICE SUITABLE THEREFOR

    公开(公告)号:US20180186676A1

    公开(公告)日:2018-07-05

    申请号:US15741256

    申请日:2016-12-14

    IPC分类号: C03B23/035

    摘要: The present invention relates to a device for bending at least one glass pane, having a lower bending mould with a working surface that is suitable for influencing the shape of at least one glass pane, an upper shaping tool arranged opposite the working surface that is suitable for generating a positive pressure on the surface of the at least one glass pane facing away from the working surface, where the upper shaping tool has a hollow space with at least one opening oriented toward the lower bending mould and a membrane closing the opening and is equipped with means for introducing a gas into the hollow space in order to deform the membrane in the direction of the lower bending mould and to thus generate the positive pressure.

    MOLDING DEVICE AND METHOD THEREOF
    6.
    发明申请

    公开(公告)号:US20180117804A1

    公开(公告)日:2018-05-03

    申请号:US15798128

    申请日:2017-10-30

    IPC分类号: B29C43/36 B29C43/02 B29C43/56

    摘要: A molding device and a molding method are provided. The molding device includes an upper molding assembly and a lower molding assembly. The upper molding assembly includes an upper molding plate and a plurality of positioning columns disposed thereon. The mold core and a plurality of matching columns surrounding the mold core are disposed at the same side of the upper molding plate. The lower molding assembly includes a lower molding plate and at least one formation mold, wherein the lower molding plate has at least one accommodating groove, a plurality of matching grooves and a plurality of positioning holes surrounding the accommodating groove. The formation mold is disposed in the accommodating groove, and the formation mold has a formation cavity corresponding to the mold core. Each positioning column is disposed respectively into each positioning hole, and each matching column is disposed respectively into each matching groove.