-
公开(公告)号：US20040245319A1
公开(公告)日：2004-12-09
申请号：US10454258
申请日：2003-06-03
IPC分类号： B23K031/12
CPC分类号： B23K3/0607 , B23K2101/42
摘要： The invention provides a method and apparatus for aligning a substrate. The apparatus comprises a ball pick head for picking up a plurality of solder balls in a ball pick-up process and depositing them onto the substrate, and a vision system adapted to view and obtain positional information of the substrate. Furthermore, a carrier is provided to which the vision system is mountable, such that operation of the vision system is decoupled from movement of the ball pick head. Drivers responsive to said positional information viewed by the vision system are operative to align at least the substrate and the ball pick head for depositing solder balls onto the substrate.
摘要翻译： 本发明提供了一种用于对准衬底的方法和装置。 该装置包括用于在球拾取过程中拾取多个焊球并将其沉积到基板上的球形拾取头，以及适于观察和获得基板的位置信息的视觉系统。 此外，提供了可安装视觉系统的载体，使得视觉系统的操作与球拍头的移动脱离。 响应于由视觉系统观看的所述位置信息的驱动器可操作以至少对准基底和球形拾取头，以将焊球沉积到基底上。
-
2.发明申请公开(公告)号：US20040003891A1
公开(公告)日：2004-01-08
申请号：US10189883
申请日：2002-07-02
IPC分类号： B32B031/00
CPC分类号： B23K3/0623 , B23K2101/40 , H05K3/3436 , H05K3/3489 , Y10T156/1089 , Y10T156/1707 , Y10T156/1798
摘要： The invention provides an apparatus and method for the application of adhesive substances to objects, such as solder balls, for the purpose of mounting them onto substrates. The apparatus comprises an applicator having a layer of the adhesive substance and a pick carrier to carry objects and move the objects from a supply source to a substrate for mounting the objects thereon. The applicator is located so that the applicator applies the adhesive substance to the objects while the objects carried on the pick carrier are moving between the supply source and the substrate.
摘要翻译： 本发明提供了一种用于将粘合剂物质应用于诸如焊球的物体的装置和方法，用于将它们安装到基底上。 该装置包括具有粘合剂物质层的拾取器和用于携带物体并将物体从供应源移动到基板以将物体安装在其上的拾取托架。 涂抹器的位置使得涂抹器将粘合剂施加到物体上，同时携带在拾取载体上的物体在供给源和基底之间移动。
-
搜索结果
2 条记录 (耗时 0.011 秒)
