利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

43 条记录 (耗时 0.014 秒)

    Three-dimensional soldering inspection apparatus and method
    2.
    发明申请
    Three-dimensional soldering inspection apparatus and method 失效
    三维焊接检测仪器及方法

    公开(公告)号：US20020179679A1

    公开(公告)日：2002-12-05

    申请号：US10137388

    申请日：2002-05-03

    发明人： Chang-Hyo Kim ,  Tae-Sun Choi

    IPC分类号： B23K031/12

    CPC分类号： B23K1/00 ,  B23K31/12

    摘要： A three-dimensional soldering inspection apparatus and method. The three-dimensional soldering inspection apparatus includes a lighting module provided with a plurality of light emitting devices, a photographing unit installed at a portion of the lighting module to photograph a subject placed inside the lighting module, an image processing unit to capture each frame image from an image photographed by the photographing unit, a storage unit to store data of each frame image, a control unit to extract three-dimensional features from each frame image and restore the extracted features as a three-dimensional image, and a display unit to display the three-dimensional image under the control of the control unit.

    摘要翻译： 一种三维焊接检测装置及方法。 三维焊接检查装置包括具有多个发光装置的照明模块，安装在照明模块的一部分拍摄放置在照明模块内的被摄体的拍摄单元，拍摄各帧图像的图像处理单元 从由拍摄单元拍摄的图像，存储单元存储每个帧图像的数据;控制单元，用于从每个帧图像提取三维特征，并将所提取的特征恢复为三维图像;以及显示单元， 在控制单元的控制下显示三维图像。

    Bonding apparatus
    3.
    发明申请
    Bonding apparatus 审中-公开
    接合装置

    公开(公告)号：US20020079350A1

    公开(公告)日：2002-06-27

    申请号：US10015691

    申请日：2001-12-17

    申请人： SHIBUYA KOGYO CO., LTD

    发明人： Touru Terada ,  Yasuhisa Matsumoto

    IPC分类号： B23K031/12

    CPC分类号： B23K31/12 ,  B23K2101/40 ,  H01L24/75

    摘要： A bonding apparatus is constituted by a bonding tool, a substrate stage, a moving mechanism for moving the bonding tool and the substrate stage, an up-and-down mechanism for moving up and down said bonding tool, and a chip recognition camera. The bonding apparatus is configured so that a chip and a substrate are subjected to positioning on the basis of a recognition result of the chip recognition camera so that the chip is bonded onto the substrate. The chip recognition camera is disposed to be lower than a level of a substrate mounted surface of the substrate stage. A lower surface of the chip is recognized in a condition that the lower surface of the chip is located to be substantially on a level with a chip bonding surface of the substrate. Positioning of the chip and the substrate is performed by the recognition image.

    摘要翻译： 接合装置由接合工具，基板台，用于移动接合工具和基板台的移动机构，用于上下移动所述接合工具的上下机构以及芯片识别照相机构成。 接合装置被配置为使得基于芯片识别相机的识别结果对芯片和基板进行定位，使得芯片被接合到基板上。 芯片识别照相机被设置为低于衬底台的衬底安装表面的水平。 芯片的下表面被识别为芯片的下表面基本上处于与基板的芯片接合表面的水平面上的状态。 通过识别图像来进行芯片和基板的定位。

    Enhanced pad design for substrate
    4.
    发明申请
    Enhanced pad design for substrate 有权
    衬底增强垫设计

    公开(公告)号：US20010010321A1

    公开(公告)日：2001-08-02

    申请号：US09804534

    申请日：2001-03-12

    发明人： John Joseph Garrity ,  John James Hannah McMorran

    IPC分类号： B23K031/12 ,  B23K031/02

    CPC分类号： B23K1/0008 ,  B23K2101/42 ,  G01R31/048 ,  G01R31/304 ,  H05K1/0269 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/09381 ,  H05K2201/10734 ,  H05K2203/041 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144

    摘要： A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of a first joining medium, such as a solder paste. Connection is made between a solder ball and a contact arranged on the substrate by means of a second joining medium. The contact arranged on the substrate is substantially quadrilateral in shape, and preferably substantially square in shape. Connection to the substrate, e.g., using round solder balls, is much more easily detected, e.g., by x-ray, than when using round pads, especially those having a smaller diameter than the balls.

    摘要翻译： 球栅阵列电子封装通过焊球和焊膏附着在基板上。 通过第一接合介质（例如焊膏）在球栅阵列上的接触点与焊球之间进行连接。 通过第二连接介质在焊球和布置在衬底上的接触件之间进行连接。 布置在基板上的接触件的形状基本上为四边形，并且优选地基本上为正方形。 比如使用圆形焊盘，特别是具有比球小的直径的焊盘，可以更容易地例如使用圆形焊球与基板连接，例如使用圆形焊球。

    Evaluation method and evaluation apparatus for spot welded portion
    5.
    发明申请
    Evaluation method and evaluation apparatus for spot welded portion 有权
    点焊部的评价方法及评价装置

    公开(公告)号：US20040262365A1

    公开(公告)日：2004-12-30

    申请号：US10849140

    申请日：2004-05-20

    发明人： Eiichi Kobayashi ,  Yusuke Kondo ,  Hisayuki Ishizu ,  Nobutaka Oda ,  Kazuo Ao

    IPC分类号： B23K031/12

    CPC分类号： G01N3/00 ,  B23K11/11 ,  B23K31/12 ,  G01N2203/0216 ,  G01N2203/0296

    摘要： The invention provides a technique for evaluation of a spot welded portion by which the strength of a panel. In the evaluation method, a stress value at a welded portion of the panel is calculated by a stress analysis according to a FEM using the elements, and then the strength of the welded portion is evaluated based on the stress value at the welded portion. Particularly, a portion in the proximity of the spot welded portion is divided, with a central portion of the spot welded portion registered with a nodal point of the elements, into a central element and a plurality of concentric ring-like elements including first and second ring-like elements from the center side provided by the central portion of the spot welded portion. Thereafter, the plural concentric ring-like elements are individually divided in a circumferential direction each into a plurality of portions to form the elements. Then, the strength is evaluated based on the stress value of the second ring-like element.

    摘要翻译： 本发明提供了一种用于评估面板强度的点焊部分的技术。 在评价方法中，通过使用这些要素的FEM的应力分析来计算面板的焊接部的应力值，然后基于焊接部的应力值来评价焊接部的强度。 特别地，点焊附近的部分被分割成点焊部分的中心部分与元件的节点对齐成中心元件和多个同心环状元件，包括第一和第二 由点焊部的中央部设置的中心侧的环状元件。 此后，多个同心环状元件在圆周方向上分别分成多个部分以形成元件。 然后，基于第二环状元件的应力值来评价强度。

    Method of manufacturing cold worked, high strength seamless CRA PIPE
    6.
    发明申请
    Method of manufacturing cold worked, high strength seamless CRA PIPE 失效
    冷加工方法，高强度无缝CRA PIPE

    公开(公告)号：US20040200881A1

    公开(公告)日：2004-10-14

    申请号：US10788686

    申请日：2004-02-27

    发明人： John Gandy

    IPC分类号： B23K031/12

    CPC分类号： F16L9/17 ,  B23K9/0253 ,  B23K2101/06 ,  Y10T29/49764 ,  Y10T29/5185

    摘要： A process produces a welded seamless PIPE having good yield strength and excellent corrosion and/or erosion resistance. Up to a maximum outside diameter corrosion and/or erosion resistant CRA PIPE is cold worked from a welded hollow, rather than using the traditional seamless pierced hollow method. A high-speed roll-forming mill is also utilized, rather than using the slow traditional break press to form the welded hollow. Welded hollow dimensions can be achieved which comply with the method of cold working's capability to produce the yield strengths and dimensional tolerances required to meet the service criteria of the PIPE's intended application.

    摘要翻译： 一种方法产生具有良好的屈服强度和优异的耐腐蚀和/或耐腐蚀性的焊接无缝PIPE。 达到最大外径腐蚀和/或耐腐蚀CRA PIPE是从焊接空心处理而不是使用传统的无缝穿孔法。 也使用高速成型轧机，而不是使用慢速传统的破碎机来形成焊接的中空部。 可以实现焊接中空尺寸，其符合冷加工能力的方法，以产生满足PIPE预期应用的服务标准所需的屈服强度和尺寸公差。

    Die attach system and process using cornercube offset tool
    8.
    发明申请
    Die attach system and process using cornercube offset tool 失效
    模具附件系统和工艺使用角撑角偏移工具

    公开(公告)号：US20030019909A1

    公开(公告)日：2003-01-30

    申请号：US10075899

    申请日：2002-02-14

    发明人： David T. Beatson ,  Christian Hoffman ,  James E. Eder ,  Jonn Ditri

    IPC分类号： B23K031/12

    CPC分类号： B23K20/002 ,  B23K20/10 ,  B23K31/12 ,  B23K2101/40 ,  H01L21/681 ,  H01L2224/78301 ,  H05K13/08

    摘要： A system and method having applications in semiconductor areas for accurate die placement on a substrate that takes into account any positional offset from the reference position due to variations caused by thermal change and other nonrandom systemic effects. The system includes an offset alignment tool having a plurality of internal reflection surfaces and located below a vision plane of the substrate, and an optical detector to receive an indirect image of a bottom surface of the die through the alignment tool, such that the die is accurately positioned on the substrate based on the indirect image received by the optical detector. The method comprises the steps of providing a cornercube offset alignment tool having a plurality of total internal reflection surfaces below a vision plane of the die, and receiving an indirect image of the die tool through the cornercube offset tool.

    摘要翻译： 一种在半导体领域中应用的系统和方法，用于在基板上准确地放置芯片，其考虑到由于热变化和其它非随机系统效应引起的变化引起的与参考位置的任何位置偏移。 该系统包括具有多个内部反射表面并且位于基板的视平面下方的偏移对准工具，以及光学检测器，用于通过对准工具接收模具底面的间接图像，使得模具是 基于由光学检测器接收的间接图像精确地定位在基板上。 该方法包括以下步骤：提供角夹角偏移对准工具，其具有在模具的视平面下方的多个全内反射表面，以及通过角架偏移工具接收模具工具的间接图像。