公开(公告)号：US12119256B2

公开(公告)日：2024-10-15

申请号：US17467250

申请日：2021-09-05

Applicant: ASM IP Holding B.V.

Inventor： Dongyang Chen

IPC: H01L21/687

CPC classification number: H01L21/68707

Abstract: A method of replacing an end effector for wafer handling in a semiconductor processing system includes fixing a first end effector jig to a first stage and a second end effector jig to a second stage of the load lock module; positioning a first end effector at the first end effector jig and a second end effector at the second end effector jig, the second end effector fixed relative to the first end effector; and fixing the second end effector to the second end effector jig. The first end effector is replaced with a replacement end effector and the semiconductor processing system returned to production without re-teaching placement of the replacement end effector in a processing module connected to a wafer handling module mounting the end effectors. Semiconductor processing systems and end effector jigs for replacing end effectors in semiconductor processing systems are also described.

公开(公告)号：US20220076986A1

公开(公告)日：2022-03-10

申请号：US17467250

申请日：2021-09-05

Applicant: ASM IP Holding B.V.

Inventor： Dongyang Chen

IPC: H01L21/687

Abstract: A method of replacing an end effector for wafer handling in a semiconductor processing system includes fixing a first end effector jig to a first stage and a second end effector jig to a second stage of the load lock module; positioning a first end effector at the first end effector jig and a second end effector at the second end effector jig, the second end effector fixed relative to the first end effector; and fixing the second end effector to the second end effector jig. The first end effector is replaced with a replacement end effector and the semiconductor processing system returned to production without re-teaching placement of the replacement end effector in a processing module connected to a wafer handling module mounting the end effectors. Semiconductor processing systems and end effector jigs for replacing end effectors in semiconductor processing systems are also described.

公开(公告)号：US20230100356A1

公开(公告)日：2023-03-30

申请号：US17934878

申请日：2022-09-23

Applicant: ASM IP Holding, B.V.

Inventor： Dongyang Chen

IPC: H01L21/687 ,  H01L21/67

Abstract: A jig for teaching substrate handling in a semiconductor processing system includes a verification pin with a pin width and a disc body. The disc body has a first surface, a second surface opposite the first surface, and a thickness separating the second surface from the first surface of the disc body. The first and second surfaces define a verification aperture coupling the first surface to the second surface of the disc body. The verification aperture has an aperture width equivalent to the pin width of the verification pin to teach a transfer position by slidably receiving the verification pin in the verification aperture and a verification pin seat defined in a load lock of the semiconductor processing system while supported by a substrate transfer robot within the semiconductor processing system. Semiconductor processing systems and methods of teaching substrate handling in semiconductor processing systems are also described.

公开(公告)号：US20250105705A1

公开(公告)日：2025-03-27

申请号：US18893498

申请日：2024-09-23

Applicant: ASM IP Holding B.V.

Inventor： Mario Gonzalez ,  Joseph Kraus ,  Dongyang Chen ,  Shaofeng Chen

IPC: H02K9/26 ,  B25J9/10 ,  H01L21/67 ,  H01L21/687 ,  H02K21/14

Abstract: A motor arrangement includes a stator body, a rotor body, a permanent magnet and a fluid conduit. The stator body defines a rotary axis and has a bore. The rotor body is supported for rotary movement about the rotary axis in the bore and is separated from the stator body by a gap. The permanent magnet is arranged within the gap and is fixed to one of the stator body and the rotor body. The fluid conduit is supported above the gap and has an outlet in fluid communication with the gap to separate the permanent magnet from an infiltrant fluid resident within an atmosphere above of the gap by issuing a barrier fluid into the atmosphere above the gap and gravimetrically flowing the barrier fluid into the gap. Semiconductor processing systems, barrier fluid kits, and methods of purging motor arrangements are also described.