公开(公告)号：US20250105705A1

公开(公告)日：2025-03-27

申请号：US18893498

申请日：2024-09-23

Applicant: ASM IP Holding B.V.

Inventor： Mario Gonzalez ,  Joseph Kraus ,  Dongyang Chen ,  Shaofeng Chen

IPC: H02K9/26 ,  B25J9/10 ,  H01L21/67 ,  H01L21/687 ,  H02K21/14

Abstract: A motor arrangement includes a stator body, a rotor body, a permanent magnet and a fluid conduit. The stator body defines a rotary axis and has a bore. The rotor body is supported for rotary movement about the rotary axis in the bore and is separated from the stator body by a gap. The permanent magnet is arranged within the gap and is fixed to one of the stator body and the rotor body. The fluid conduit is supported above the gap and has an outlet in fluid communication with the gap to separate the permanent magnet from an infiltrant fluid resident within an atmosphere above of the gap by issuing a barrier fluid into the atmosphere above the gap and gravimetrically flowing the barrier fluid into the gap. Semiconductor processing systems, barrier fluid kits, and methods of purging motor arrangements are also described.

公开(公告)号：US20230235428A1

公开(公告)日：2023-07-27

申请号：US18100048

申请日：2023-01-23

Applicant: ASM IP Holding B.V.

Inventor： Joaquin Aguilar Santillan ,  Hong Gao ,  Shanker Kuttath ,  Shaofeng Chen ,  Gary Urban Keppers ,  Felix Rabinovich

IPC: C22C1/02 ,  C22C21/08 ,  B22D21/00 ,  H01L21/67 ,  H01L21/687

CPC classification number: C22C1/026 ,  C22C21/08 ,  B22D21/007 ,  H01L21/67167 ,  H01L21/68707 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201

Abstract: A substrate handling chamber body is formed from a castable aluminum alloy including a manganese (Mn) constituent and an iron (Fe) constituent. The castable aluminum alloy has a manganese (Mn) constituent-to-iron (Fe) constituent ratio that between about 1.125 and about 1.525 to limit microporosity and shrinkage porosity within the castable aluminum alloy forming the substrate handling chamber body. Semiconductor processing systems and methods of making substrate handling chamber bodies for semiconductor processing systems are also described.