SUBSTRATE SUPPORT ASSEMBLY AND SUBSTRATE PROCESSING DEVICE INCLUDING THE SAME

    公开(公告)号:US20230253238A1

    公开(公告)日:2023-08-10

    申请号:US18136559

    申请日:2023-04-19

    CPC classification number: H01L21/68764 H01L21/6708

    Abstract: A substrate support assembly arranged in a chamber includes: a support plate including a first surface on which a substrate is seated; a driver configured to tilt the support plate such that the first surface is inclined with respect to a reference surface by a lower inclination angle; and a controller configured to control the driver such that the lower inclination angle is adjusted based on an upper inclination angle formed by the inclination of the gas supplier coupled to the upper surface of the chamber with respect to the reference surface.

    SUBSTRATE SUPPORT ASSEMBLY AND SUBSTRATE PROCESSING DEVICE INCLUDING THE SAME

    公开(公告)号:US20210013085A1

    公开(公告)日:2021-01-14

    申请号:US16922741

    申请日:2020-07-07

    Abstract: A substrate support assembly arranged in a chamber includes: a support plate including a first surface on which a substrate is seated; a driver configured to tilt the support plate such that the first surface is inclined with respect to a reference surface by a lower inclination angle; and a controller configured to control the driver such that the lower inclination angle is adjusted based on an upper inclination angle formed by the inclination of the gas supplier coupled to the upper surface of the chamber with respect to the reference surface.

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