公开(公告)号：US20180223424A1

公开(公告)日：2018-08-09

申请号：US15945863

申请日：2018-04-05

Applicant: ASM IP Holding B.V.

Inventor： Young-Jae KIM ,  Ki Jong KIM ,  Dong-Rak JUNG ,  Hak Yong KWON ,  Seung Woo CHOI

IPC: C23C16/44 ,  C23C16/458 ,  H01L21/687

CPC classification number: C23C16/4401 ,  C23C16/4586 ,  H01L21/68742

Abstract: A deposition apparatus is provided to eliminate unnecessary empty spaces that may form between a substrate and a substrate supporting pin, which may be formed within a substrate supporting pin hole, by covering the substrate supporting pin, inserted into the substrate supporting pin hole formed in the substrate support, by a substrate supporting pin cover loaded on the substrate support. Accordingly, the temperature under the substrate can be maintained constant, and generation of parasitic plasma or contaminating particles can be avoided.