公开(公告)号：US11885023B2

公开(公告)日：2024-01-30

申请号：US16584283

申请日：2019-09-26

Applicant: ASM IP Holding B.V.

Inventor： Shiva K. T. Rajavelu Muralidhar ,  Sam Kim ,  Jeffrey Barrett Robinson ,  James King Wilson, Jr. ,  Ninad Vijay Sonje

IPC: C23C16/46 ,  H01L21/67 ,  H01L21/687 ,  C23C16/458 ,  C23C16/44

CPC classification number: C23C16/466 ,  C23C16/4411 ,  C23C16/4586 ,  H01L21/67201 ,  H01L21/68757

Abstract: A substrate retaining apparatus, a load lock assembly comprising the substrate retaining apparatus, and a system including the substrate retaining apparatus are disclosed. The substrate retaining apparatus can include at least one sidewall and one or more heat shields. One or more of the at least one sidewall can include a cooling fluid conduit to facilitate cooling of substrates retained by the substrate retaining apparatus. Additionally or alternatively, one or more of the at least one sidewall can include a gas conduit to provide gas to a surface of a retained substrate.