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1.发明申请公开(公告)号：US20190196341A1
公开(公告)日：2019-06-27
申请号：US16328750
申请日：2017-08-18
Applicant: ASML HOLDING N.V. , ASML NETHERLANDS B.V.
Abstract: A method, including printing an apparatus mark onto a structure while the structure is at least partly within a lithographic apparatus. The structure may be part of, or is located on, a substrate table, but is separate from a substrate to be held by the apparatus. The method further includes measuring the apparatus mark using a sensor system within the apparatus.
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公开(公告)号：US20240263941A1
公开(公告)日：2024-08-08
申请号：US18562675
申请日：2022-05-24
Applicant: ASML Netherlands B.V.
Inventor： Rui CHENG , Joshua ADAMS , Franciscus Godefridus Casper BIJNEN , Eric Brian CATEY , Igor Matheus Petronella AARTS
CPC classification number: G01B11/272 , G03F9/7046 , G03F9/7065 , G03F9/7069 , G03F9/7076 , G03F9/7092
Abstract: Systems, apparatuses, and methods are provided for correcting the detected positions of alignment marks disposed on a substrate and aligning the substrate using the corrected data to accurately expose patterns on the substrate. An example method can include receiving a measurement signal including a combined intensity signal corresponding to first and second diffracted light beams diffracted from first and second alignment targets having different orientations. The example method can further include fitting the combined intensity signal using templates to determine weight values and determining, based on the templates and weight values, first and second intensity sub-signals corresponding to the first and second diffracted light beams. The method can further include determining first and second intensity imbalance signals based on the first and second intensity sub-signals and determining a set of corrections to the measurement signal based on the first and second intensity imbalance signals.
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公开(公告)号：US20200326640A1
公开(公告)日：2020-10-15
申请号：US16760137
申请日：2018-10-26
Applicant: ASML Holding N.V.
Inventor： Irit TZEMAH , Eric Brian CATEY , John David CONNELLY
Abstract: A lithographic cluster includes a track unit and a lithographic apparatus. The lithographic apparatus includes an alignment sensor and at least one controller. The track unit is configured to process a first lot and a second lot. The lithographic apparatus is operatively coupled to the track unit. The alignment sensor is configured to measure an alignment of at least one alignment mark type of a calibration wafer. At least one controller is configured to determine a correction set for calibrating the lithographic apparatus based on the measured alignment of the at least one alignment mark type and apply first and second weight corrections to the correction set for processing the first and second lots, respectively, such that overlay drifts or jumps during processing the first and second lots are mitigated.
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公开(公告)号：US20190227443A1
公开(公告)日：2019-07-25
申请号：US16313687
申请日：2017-06-26
Applicant: ASML Holding N.V.
Abstract: A method of applying a measurement correction includes calculating a first correction value based on a first coefficient and the measurement; calculating a second correction value based on a second coefficient, greater than the first coefficient, and the measurement; and calculating a third correction value based on a third coefficient, greater than the second coefficient, and the measurement. The method also includes applying the third correction value to the measurement if a difference between the first correction value and the third correction value is above a first threshold value; applying the second correction value to the measurement if a difference between the first correction value and the second correction value is above a second threshold value; and applying the first correction value to the measurement if the difference between the first correction value and the second correction value is below or equal to the second threshold value.
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