SEMICONDUCTOR CHARGED PARTICLE DETECTOR FOR MICROSCOPY

    公开(公告)号:US20230123152A1

    公开(公告)日:2023-04-20

    申请号:US17970469

    申请日:2022-10-20

    摘要: A detector may be provided with an array of sensing elements. The detector may include a semiconductor substrate including the array, and a circuit configured to count a number of charged particles incident on the detector. The circuit of the detector may be configured to process outputs from the plurality of sensing elements and increment a counter in response to a charged particle arrival event on a sensing element of the array. Various counting modes may be used. Counting may be based on energy ranges. Numbers of charged particles may be counted at a certain energy range and an overflow flag may be set when overflow is encountered in a sensing element. The circuit may be configured to determine a time stamp of respective charged particle arrival events occurring at each sensing element. Size of the sensing element may be determined based on criteria for enabling charged particle counting.

    CHARGED PARTICLE DETECTOR WITH GAIN ELEMENT
    2.
    发明申请

    公开(公告)号:US20200273664A1

    公开(公告)日:2020-08-27

    申请号:US16800946

    申请日:2020-02-25

    摘要: A detector may be provided with a sensing element or an array of sensing elements, each of the sensing elements may have a corresponding gain element. A substrate may be provided having a sensing element and a gain element integrated together. The gain element may include a section in which, along a direction perpendicular to an incidence direction of an electron beam, a region of first conductivity is provided adjacent to a region of second conductivity, and a region of third conductivity may be provided adjacent to the region of second conductivity. The sensing element may include a section in which, along the incidence direction, a region of fourth conductivity is provided adjacent to an intrinsic region of the substrate, and the region of second conductivity may be provided adjacent to the intrinsic region.

    FIELD PROGRAMMABLE DETECTOR ARRAY
    3.
    发明申请

    公开(公告)号:US20200219696A1

    公开(公告)日:2020-07-09

    申请号:US16648288

    申请日:2018-09-14

    IPC分类号: H01J37/244 H01L27/146

    摘要: Systems and methods for implementing a detector array are disclosed. According to certain embodiments, a substrate comprises a plurality of sensing elements including a first element and a second element. The detector comprises a switching element configured to connect the first element and the second element. The switching region may be controlled based on signals generated in response to the sensing elements receiving electrons with a predetermined amount of energy.

    SWITCH MATRIX DESIGN FOR BEAM IMAGE SYSTEM

    公开(公告)号:US20230005707A1

    公开(公告)日:2023-01-05

    申请号:US17944121

    申请日:2022-09-13

    IPC分类号: H01J37/244 H01L27/146

    摘要: Systems and methods for implementing a detector array are disclosed. According to certain embodiments, a substrate comprises a plurality of sensing elements including a first element and a second element. The detector comprises a switching element configured to connect the first element and the second element. The switching region may be controlled based on signals generated in response to the sensing elements receiving electrons with a predetermined amount of energy.

    FIELD PROGRAMMABLE DETECTOR ARRAY

    公开(公告)号:US20220415608A1

    公开(公告)日:2022-12-29

    申请号:US17856848

    申请日:2022-07-01

    IPC分类号: H01J37/244 H01L27/146

    摘要: Systems and methods for implementing a detector array are disclosed. According to certain embodiments, a substrate comprises a plurality of sensing elements including a first element and a second element, and a switching region therebetween configured to connect the first element and the second element. The switching region may be controlled based on signals generated in response to the sensing elements receiving electrons with a predetermined amount of energy.

    MEMS IMAGE FORMING ELEMENT WITH BUILT-IN VOLTAGE GENERATOR

    公开(公告)号:US20200317504A1

    公开(公告)日:2020-10-08

    申请号:US16841044

    申请日:2020-04-06

    IPC分类号: B81B3/00 B81B7/00

    摘要: The present disclosure describes an image forming element having a semiconductor chip with micro-electro-mechanical-system (MEMS) devices and voltage generators, each voltage generator being configured to generate a voltage used by one or more of the MEMS devices. A floating ground may be used to add a voltage to the voltage generated by the voltage generators. The semiconductor chip may include electrical connections, where each voltage generator is configured to provide the voltage to the one or more MEMS devices through the electrical connections. The MEMS devices may define a boundary in the semiconductor chip within which the MEMS devices, the voltage generators, and the electrical connections are located. Each MEMS device may generate an electrostatic field to manipulate an electron beamlet of a multi-beam charged particle microscope. The MEMS devices may be organized into groups based on a distance to a reference location (e.g., optical axis) in the semiconductor chip.

    PRINTED CIRCUIT BOARD FOR SEALING VACUUM SYSTEM

    公开(公告)号:US20220059311A1

    公开(公告)日:2022-02-24

    申请号:US17408267

    申请日:2021-08-20

    IPC分类号: H01J37/16 H05K1/02 H05K1/03

    摘要: Detector modules, systems and methods for detecting signal beams are disclosed using a detector module and a support comprising a feedthrough.
    Furthermore, apparatuses, systems, and methods for sealing a vacuum system configured to provide an atmospheric environment and a vacuum chamber environment are disclosed. In some embodiments, a printed circuit board (PCB) comprising a first side for exposing to the atmospheric environment and a second side for exposing to the vacuum chamber environment and for covering an aperture in the vacuum chamber environment, wherein the second side is opposite to the first side. The apparatuses, systems, and methods may include a rigid body on the first side of the PCB and a device connected to the second side of the PCB and positioned on a portion of the PCB that covers the aperture. The PCB may be configured to provide an interface between the device and the rigid body.

    ARCHITECTURE FOR LARGE ACTIVE AREA HIGH SPEED DETECTOR

    公开(公告)号:US20210134557A1

    公开(公告)日:2021-05-06

    申请号:US17044840

    申请日:2019-03-14

    IPC分类号: H01J37/244 H01L27/146

    摘要: Detectors and detection systems are disclosed. According to certain embodiments, a substrate comprises a plurality of sensing elements including a first plurality of the sensing elements and a second plurality of the sensing elements, and a plurality of sections configured to connect the first plurality to an output, and connect the second plurality to an output. Switching regions may be provided between the sensing elements that are configured to connect two or more sensing elements. The switching region may be controlled based on signals generated in response to the sensing elements receiving electrons with a predetermined amount of energy and/or beam intensity.

    SWITCH MATRIX DESIGN FOR BEAM IMAGE SYSTEM
    9.
    发明申请

    公开(公告)号:US20200227229A1

    公开(公告)日:2020-07-16

    申请号:US16648385

    申请日:2018-09-14

    IPC分类号: H01J37/244 H01L27/146

    摘要: Systems and methods for implementing a detector array are disclosed. According to certain embodiments, a substrate comprises a plurality of sensing elements including a first element and a second element. The detector comprises a switching element configured to connect the first element and the second element. The switching region may be controlled based on signals generated in response to the sensing elements receiving electrons with a predetermined amount of energy.