公开(公告)号：US11861818B2

公开(公告)日：2024-01-02

申请号：US17723322

申请日：2022-04-18

Applicant: ASML Netherlands B.V.

Inventor： Zhichao Chen ,  Wei Fang

IPC: G06T7/00 ,  G01N21/95

CPC classification number: G06T7/0004 ,  G01N21/9501 ,  G06T2207/30148

Abstract: A defect inspection system is disclosed. According to certain embodiments, the system includes a memory storing instructions implemented as a plurality of modules. Each of the plurality of modules is configured to detect defects having a different property. The system also includes a controller configured to cause the computer system to: receive inspection data representing an image of a wafer; input the inspection data to a first module of the plurality of modules, the first module outputs a first set of points of interests (POIs) having a first property; input the first set of POIs to a second module of the plurality of modules, the second module output a second set of POIs having the second property; and report that the second set of POIs as defects having both the first property and the second property.

公开(公告)号：US11308602B2

公开(公告)日：2022-04-19

申请号：US16479203

申请日：2018-01-18

Applicant: ASML Netherlands B.V.

Inventor： Zhichao Chen ,  Wei Fang

IPC: G06T7/00 ,  G01N21/95

Abstract: A defect inspection system is disclosed. According to certain embodiments, the system includes a memory storing instructions implemented as a plurality of modules. Each of the plurality of modules is configured to detect defects having a different property. The system also includes a controller configured to cause the computer system to: receive inspection data representing an image of a wafer; input the inspection data to a first module of the plurality of modules, the first module outputs a first set of points of interests (POIs) having a first property; input the first set of POIs to a second module of the plurality of modules, the second module output a second set of POIs having the second property; and report that the second set of POIs as defects having both the first property and the second property.

公开(公告)号：US11238579B2

公开(公告)日：2022-02-01

申请号：US16479138

申请日：2018-01-18

Applicant: ASML Netherlands B.V.

Inventor： Wei Fang ,  Haili Zhang ,  Zhichao Chen ,  Shengcheng Jin

IPC: G06T7/00 ,  G03F7/20 ,  G05B19/406

Abstract: A defect pattern grouping method is disclosed. The defect pattern grouping method comprises obtaining a first polygon that represents a first defect from an image of a sample, comparing the first polygon with a set of one or more representative polygons of a defect-pattern collection, and grouping the first polygon with any one or more representative polygons identified based on the comparison.

公开(公告)号：US11126089B2

公开(公告)日：2021-09-21

申请号：US16848724

申请日：2020-04-14

Applicant: ASML NETHERLANDS B.V.

Inventor： Wei Fang ,  Lingling Pu ,  Zhichao Chen ,  Haili Zhang ,  Pengcheng Zhang

IPC: G03F7/20 ,  G03F1/36

Abstract: A method for determining corrections to features of a mask. The method includes obtaining (i) a pattern group for a design layout, and (ii) defect inspection data of a substrate imaged using the mask used in the patterning process for the design layout; determining, based on the defect inspection data, a defect map associated with the pattern group, wherein the defect map comprises locations of assist features having a relatively higher probability of being printed on the substrate compared to other patterns of the design layout; and determining, via simulating an optical proximity correction process using data associated with the defect map, corrections to the features of the mask.

公开(公告)号：US20200326632A1

公开(公告)日：2020-10-15

申请号：US16848724

申请日：2020-04-14

Applicant: ASML NETHERLANDS B.V.

Inventor： Wei Fang ,  Lingling Pu ,  Zhichao Chen ,  Haili Zhang ,  Pengcheng Zhang

IPC: G03F7/20

Abstract: A method for determining corrections to features of a mask. The method includes obtaining (i) a pattern group for a design layout, and (ii) defect inspection data of a substrate imaged using the mask used in the patterning process for the design layout; determining, based on the defect inspection data, a defect map associated with the pattern group, wherein the defect map comprises locations of assist features having a relatively higher probability of being printed on the substrate compared to other patterns of the design layout; and determining, via simulating an optical proximity correction process using data associated with the defect map, corrections to the features of the mask.