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公开(公告)号:US11734490B2
公开(公告)日:2023-08-22
申请号:US17564837
申请日:2021-12-29
Applicant: ASML NETHERLANDS B.V.
Inventor: Quan Zhang , Been-Der Chen , Rafael C. Howell , Jing Su , Yi Zou , Yen-Wen Lu
IPC: G06F30/30 , G03F1/30 , G03F7/20 , G06F30/398 , G03F1/36 , G03F1/70 , G03F7/00 , G06F119/18
CPC classification number: G06F30/398 , G03F1/36 , G03F1/70 , G03F7/70441 , G03F7/705 , G06F2119/18
Abstract: A method to determine a curvilinear pattern of a patterning device that includes obtaining (i) an initial image of the patterning device corresponding to a target pattern to be printed on a substrate subjected to a patterning process, and (ii) a process model configured to predict a pattern on the substrate from the initial image, generating, by a hardware computer system, an enhanced image from the initial image, generating, by the hardware computer system, a level set image using the enhanced image, and iteratively determining, by the hardware computer system, a curvilinear pattern for the patterning device based on the level set image, the process model, and a cost function, where the cost function (e.g., EPE) determines a difference between a predicted pattern and the target pattern, where the difference is iteratively reduced.
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公开(公告)号:US11232249B2
公开(公告)日:2022-01-25
申请号:US16976492
申请日:2019-02-28
Applicant: ASML NETHERLANDS B.V.
Inventor: Quan Zhang , Been-Der Chen , Rafael C. Howell , Jing Su , Yi Zou , Yen-Wen Lu
IPC: G06F30/30 , G03F1/30 , G03F7/20 , G06F30/398 , G03F1/36 , G03F1/70 , G06F119/18
Abstract: A method to determine a curvilinear pattern of a patterning device that includes obtaining (i) an initial image of the patterning device corresponding to a target pattern to be printed on a substrate subjected to a patterning process, and (ii) a process model configured to predict a pattern on the substrate from the initial image, generating, by a hardware computer system, an enhanced image from the initial image, generating, by the hardware computer system, a level set image using the enhanced image, and iteratively determining, by the hardware computer system, a curvilinear pattern for the patterning device based on the level set image, the process model, and a cost function, where the cost function (e.g., EPE) determines a difference between a predicted pattern and the target pattern, where the difference is iteratively reduced.
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公开(公告)号:US12038694B2
公开(公告)日:2024-07-16
申请号:US18118695
申请日:2023-03-07
Applicant: ASML NETHERLANDS B.V.
Inventor: Youping Zhang , Maxime Philippe Frederic Genin , Cong Wu , Jing Su , Weixuan Hu , Yi Zou
IPC: G03F7/00
CPC classification number: G03F7/705 , G03F7/70675
Abstract: Methods for training a process model and determining ranking of simulated patterns (e.g., corresponding to hot spots). A method involves obtaining a training data set including: (i) a simulated pattern associated with a mask pattern to be printed on a substrate, (ii) inspection data of a printed pattern imaged on the substrate using the mask pattern, and (iii) measured values of a parameter of the patterning process applied during imaging of the mask pattern on the substrate; and training a machine learning model for the patterning process based on the training data set to predict a difference in a characteristic of the simulated pattern and the printed pattern. The trained machine learning model can be used for determining a ranking of hot spots. In another method a model is trained based on measurement data to predict ranking of the hot spots.
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公开(公告)号:US11768440B2
公开(公告)日:2023-09-26
申请号:US18089007
申请日:2022-12-27
Applicant: ASML NETHERLANDS B.V.
Inventor: Jing Su , Yen-Wen Lu , Ya Luo
CPC classification number: G03F7/70441 , G03F7/705 , G06N5/047 , G06N20/00
Abstract: A method including: obtaining data based an optical proximity correction for a spatially shifted version of a training design pattern; and training a machine learning model configured to predict optical proximity corrections for design patterns using data regarding the training design pattern and the data based on the optical proximity correction for the spatially shifted version of the training design pattern.
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公开(公告)号:US11561477B2
公开(公告)日:2023-01-24
申请号:US16640500
申请日:2018-09-05
Applicant: ASML NETHERLANDS B.V.
Inventor: Jing Su , Yen-Wen Lu , Ya Luo
Abstract: A method including: obtaining data based an optical proximity correction for a spatially shifted version of a training design pattern; and training a machine learning model configured to predict optical proximity corrections for design patterns using data regarding the training design pattern and the data based on the optical proximity correction for the spatially shifted version of the training design pattern.
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公开(公告)号:US20240012335A1
公开(公告)日:2024-01-11
申请号:US18233365
申请日:2023-08-14
Applicant: ASML NETHERLANDS B.V.
Inventor: Jing Su , Yen-Wen Lu , Ya Luo
CPC classification number: G03F7/70441 , G06N20/00 , G03F7/705 , G06N5/047
Abstract: A method including: obtaining data based an optical proximity correction for a spatially shifted version of a training design pattern; and training a machine learning model configured to predict optical proximity corrections for design patterns using data regarding the training design pattern and the data based on the optical proximity correction for the spatially shifted version of the training design pattern.
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公开(公告)号:US12204250B2
公开(公告)日:2025-01-21
申请号:US18233365
申请日:2023-08-14
Applicant: ASML NETHERLANDS B.V.
Inventor: Jing Su , Yen-Wen Lu , Ya Luo
Abstract: A method including: obtaining data based an optical proximity correction for a spatially shifted version of a training design pattern; and training a machine learning model configured to predict optical proximity corrections for design patterns using data regarding the training design pattern and the data based on the optical proximity correction for the spatially shifted version of the training design pattern.
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公开(公告)号:US20230236512A1
公开(公告)日:2023-07-27
申请号:US18118695
申请日:2023-03-07
Applicant: ASML NETHERLANDS B.V.
Inventor: Youping ZHANG , Maxime Philippe Frederic Genin , Cong Wu , Jing Su , Weixuan Hu , Yi Zou
IPC: G03F7/20
CPC classification number: G03F7/705 , G03F7/70675
Abstract: Methods for training a process model and determining ranking of simulated patterns (e.g., corresponding to hot spots). A method involves obtaining a training data set including: (i) a simulated pattern associated with a mask pattern to be printed on a substrate, (ii) inspection data of a printed pattern imaged on the substrate using the mask pattern, and (iii) measured values of a parameter of the patterning process applied during imaging of the mask pattern on the substrate; and training a machine learning model for the patterning process based on the training data set to predict a difference in a characteristic of the simulated pattern and the printed pattern. The trained machine learning model can be used for determining a ranking of hot spots. In another method a model is trained based on measurement data to predict ranking of the hot spots.
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公开(公告)号:US20230137097A1
公开(公告)日:2023-05-04
申请号:US18089007
申请日:2022-12-27
Applicant: ASML NETHERLANDS B.V.
Inventor: Jing Su , Yen-Wen Lu , Ya Luo
Abstract: A method including: obtaining data based an optical proximity correction for a spatially shifted version of a training design pattern; and training a machine learning model configured to predict optical proximity corrections for design patterns using data regarding the training design pattern and the data based on the optical proximity correction for the spatially shifted version of the training design pattern.
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公开(公告)号:US11635699B2
公开(公告)日:2023-04-25
申请号:US17312709
申请日:2019-12-04
Applicant: ASML NETHERLANDS B.V.
Inventor: Youping Zhang , Maxime Philippe Frederic Genin , Cong Wu , Jing Su , Weixuan Hu , Yi Zou
IPC: G03F7/20
Abstract: Methods for training a process model and determining ranking of simulated patterns (e.g., corresponding to hot spots). A method involves obtaining a training data set including: (i) a simulated pattern associated with a mask pattern to be printed on a substrate, (ii) inspection data of a printed pattern imaged on the substrate using the mask pattern, and (iii) measured values of a parameter of the patterning process applied during imaging of the mask pattern on the substrate; and training a machine learning model for the patterning process based on the training data set to predict a difference in a characteristic of the simulated pattern and the printed pattern. The trained machine learning model can be used for determining a ranking of hot spots. In another method a model is trained based on measurement data to predict ranking of the hot spots.
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