Method of Applying a Pattern to a Substrate, Device Manufacturing Method and Lithographic Apparatus for Use in Such Methods
    1.
    发明申请
    Method of Applying a Pattern to a Substrate, Device Manufacturing Method and Lithographic Apparatus for Use in Such Methods 有权
    将图案应用于基板的方法,用于这种方法的装置制造方法和平版印刷装置

    公开(公告)号:US20150153656A1

    公开(公告)日:2015-06-04

    申请号:US14613687

    申请日:2015-02-04

    Abstract: A substrate is loaded onto a substrate support of a lithographic apparatus, after which the apparatus measures locations of substrate alignment marks. These measurements define first correction information allowing the apparatus to apply a pattern at one or more desired locations on the substrate. Additional second correction information is used to enhance accuracy of pattern positioning, in particular to correct higher order distortions of a nominal alignment grid. The second correction information may be based on measurements of locations of alignment marks made when applying a previous pattern to the same substrate. The second correction information may alternatively or in addition be based on measurements made on similar substrates that have been patterned prior to the current substrate.

    Abstract translation: 衬底被加载到光刻设备的衬底支撑件上,之后设备测量衬底对准标记的位置。 这些测量定义了第一校正信息,允许设备在衬底上的一个或多个所需位置上施加图案。 附加的第二校正信息用于增强图案定位的精度,特别是校正标称对准格栅的较高阶失真。 第二校正信息可以基于当对同一衬底施加先前图案时制作的对准标记的位置的测量。 第二校正信息可以替代地或另外基于在当前衬底之前已被图案化的类似衬底上进行的测量。

Patent Agency Ranking