公开(公告)号：US20240284610A1

公开(公告)日：2024-08-22

申请号：US18328046

申请日：2023-06-02

Applicant: ASUSTEK COMPUTER INC.

Inventor： Yu-Jung LIN ,  Ing-Jer CHIOU ,  Cheng-Yu WANG

IPC: H05K5/02 ,  B32B3/26 ,  B32B5/18 ,  B32B7/14 ,  B32B27/06

CPC classification number: H05K5/0211 ,  B32B3/266 ,  B32B5/18 ,  B32B7/14 ,  B32B27/065 ,  B32B2307/304 ,  B32B2307/7376 ,  B32B2457/00

Abstract: A heat insulation pad applied to an electronic device is provided. The electronic device includes a housing and a heat source. The housing includes an inner side surface. The heat insulation pad includes a first contact layer, a second contact layer, and a hole layer stack structure. The first contact layer is adapted to attach to the inner side surface. The second contact layer is adapted to contact the heat source. The hole layer stack structure includes a plurality of hole layers stacked in sequence and is located between the first contact layer and the second contact layer. An electronic device with the heat insulation pad is further provided.