公开(公告)号：US20180139845A1

公开(公告)日：2018-05-17

申请号：US15813246

申请日：2017-11-15

Applicant: ASUSTeK COMPUTER INC.

Inventor： Bing-Min LIN ,  Teng-Liang NG ,  Ji-Kuang TAN ,  Ming-Fang TSAI ,  Chih-Kuang LIN

IPC: H05K1/18 ,  H05K1/02 ,  H05K7/20 ,  G08B5/38

CPC classification number: H05K1/181 ,  G06F1/183 ,  G06F1/20 ,  G06F11/3058 ,  G06F11/325 ,  G08B5/38 ,  H05K1/0274 ,  H05K1/18 ,  H05K7/20172 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09172 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/10446 ,  H05K2201/10522

Abstract: A motherboard is provided. The motherboard includes a main body, a notch formed at a side edge of the main body, and a fixing device formed adjacent to the notch to fix an auxiliary device. The function of the motherboard is expanded significantly while artistic of the appearance of the motherboard is improved.

公开(公告)号：US20190018456A1

公开(公告)日：2019-01-17

申请号：US16031593

申请日：2018-07-10

Applicant: ASUSTEK COMPUTER INC.

Inventor： Szu-Tang CHIU ,  Sin-Fei LAI ,  Chih-Kuang LIN ,  Wai-Tong CHAN

IPC: G06F1/16 ,  G06F1/20 ,  G06F1/18

CPC classification number: G06F1/1656 ,  G06F1/182 ,  G06F1/20

Abstract: The present disclosure provides an electronic device. The electronic device includes a casing and a detachable unit. The casing includes an opening. The detachable unit is selectively disposed in the opening. The detachable unit includes a recognizing element. The detachable unit is provided for the electronic device provided in the present disclosure. In addition to having an electromagnetic shielding effect, the detachable unit can further provide various different functions, such as cooling, storage, display, communication, and accommodation. A user selects different detachable units according to needs. Therefore, the electronic device provided in the present disclosure helps improve user experience.

公开(公告)号：US20190018455A1

公开(公告)日：2019-01-17

申请号：US16031479

申请日：2018-07-10

Applicant: ASUSTEK COMPUTER INC.

Inventor： Chih-Kuang LIN ,  Szu-Tang CHIU ,  Wai-Tong CHAN ,  Sin-Fei LAI

IPC: G06F1/16

Abstract: The present disclosure provides a housing assembly, and the housing assembly is applied to an electronic device. The housing assembly includes a first part and a second part. The first part includes at least one opening. The second part includes at least one mesh area. The mesh area deformably connects to the first part, and covers the opening.