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公开(公告)号：US12007816B2
公开(公告)日：2024-06-11
申请号：US17852372
申请日：2022-06-29
Applicant: ASUSTeK COMPUTER INC.
Inventor： Dun-Hao Yang , Kuang-Yu Chang , Ming-Fang Tsai
CPC classification number: G06F1/185 , H05K1/0204
Abstract: A heat dissipation module is adapted for a circuit board, which has an M.2 bonding hole. The heat dissipation module includes a supporting bracket and a heat dissipation element. The supporting bracket has a first side and a second side opposite to each other, and an accommodating space, which is located between the first side and the second side, and is adapted for installing an SSD interface card. The first side has a first mounting hole and a second mounting hole. The heat dissipation element is combined to the first side through the first mounting hole. When the SSD interface card is installed in the accommodating space, the SSD interface card and the supporting bracket are combined to the M.2 bonding hole through the second mounting hole so that the second side faces the circuit board.
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公开(公告)号：US20230205284A1
公开(公告)日：2023-06-29
申请号：US17852372
申请日：2022-06-29
Applicant: ASUSTeK COMPUTER INC.
Inventor： Dun-Hao Yang , Kuang-Yu Chang , Ming-Fang Tsai
CPC classification number: G06F1/185 , H05K1/0204
Abstract: A heat dissipation module is adapted for a circuit board, which has an M.2 bonding hole. The heat dissipation module includes a supporting bracket and a heat dissipation element. The supporting bracket has a first side and a second side opposite to each other, and an accommodating space, which is located between the first side and the second side, and is adapted for installing an SSD interface card. The first side has a first mounting hole and a second mounting hole. The heat dissipation element is combined to the first side through the first mounting hole. When the SSD interface card is installed in the accommodating space, the SSD interface card and the supporting bracket are combined to the M.2 bonding hole through the second mounting hole so that the second side faces the circuit board.
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