公开(公告)号：US12007816B2

公开(公告)日：2024-06-11

申请号：US17852372

申请日：2022-06-29

Applicant: ASUSTeK COMPUTER INC.

Inventor： Dun-Hao Yang ,  Kuang-Yu Chang ,  Ming-Fang Tsai

IPC: G06F1/18 ,  H05K1/02

CPC classification number: G06F1/185 ,  H05K1/0204

Abstract: A heat dissipation module is adapted for a circuit board, which has an M.2 bonding hole. The heat dissipation module includes a supporting bracket and a heat dissipation element. The supporting bracket has a first side and a second side opposite to each other, and an accommodating space, which is located between the first side and the second side, and is adapted for installing an SSD interface card. The first side has a first mounting hole and a second mounting hole. The heat dissipation element is combined to the first side through the first mounting hole. When the SSD interface card is installed in the accommodating space, the SSD interface card and the supporting bracket are combined to the M.2 bonding hole through the second mounting hole so that the second side faces the circuit board.

公开(公告)号：US20230205284A1

公开(公告)日：2023-06-29

申请号：US17852372

申请日：2022-06-29

Applicant: ASUSTeK COMPUTER INC.

Inventor： Dun-Hao Yang ,  Kuang-Yu Chang ,  Ming-Fang Tsai

IPC: G06F1/18 ,  H05K1/02

CPC classification number: G06F1/185 ,  H05K1/0204

Abstract: A heat dissipation module is adapted for a circuit board, which has an M.2 bonding hole. The heat dissipation module includes a supporting bracket and a heat dissipation element. The supporting bracket has a first side and a second side opposite to each other, and an accommodating space, which is located between the first side and the second side, and is adapted for installing an SSD interface card. The first side has a first mounting hole and a second mounting hole. The heat dissipation element is combined to the first side through the first mounting hole. When the SSD interface card is installed in the accommodating space, the SSD interface card and the supporting bracket are combined to the M.2 bonding hole through the second mounting hole so that the second side faces the circuit board.

公开(公告)号：US10314170B2

公开(公告)日：2019-06-04

申请号：US15813246

申请日：2017-11-15

Applicant: ASUSTeK COMPUTER INC.

Inventor： Bing-Min Lin ,  Teng-Liang Ng ,  Ji-Kuang Tan ,  Ming-Fang Tsai ,  Chih-Kuang Lin

IPC: H05K1/18 ,  G08B5/38 ,  H05K1/02 ,  H05K7/20 ,  G06F1/18 ,  G06F1/20 ,  G06F11/30 ,  G06F11/32

Abstract: A motherboard of a computer is provided. The motherboard of a computer includes a main body, a notch formed at a side edge of the main body, an auxiliary device, and a fixing device formed adjacent to the notch to fix the auxiliary device in the notch, wherein the auxiliary device is a light guiding device including patterns.