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公开(公告)号:US20200373667A1
公开(公告)日:2020-11-26
申请号:US16993575
申请日:2020-08-14
Applicant: AUTEL ROBOTICS CO, LTD.
Inventor: Shengzhao XIANG , Yiye SUN , Xuefeng SUN
Abstract: The present invention provides an unmanned aerial vehicle built-in dual-band antenna and an unmanned aerial vehicle. The unmanned aerial vehicle built-in dual-band antenna includes a first frequency band microstrip antenna and a second frequency band microstrip antenna. The first frequency band microstrip antenna includes a first substrate, a first microstrip feeder and a grounding terminal that are disposed on a first surface of the first substrate, a grounding terminal disposed on a second surface of the first substrate and a feeding coaxial line. A feed terminal of the feeding coaxial line is connected to a first terminal of the first microstrip feeder, and a grounding terminal of the feeding coaxial line is connected to the grounding terminal of the first surface. The grounding terminal of the first surface is connected to the grounding terminal of the second surface. The second frequency band microstrip antenna includes a second substrate and a second microstrip feeder disposed on the second substrate. The first frequency band microstrip antenna is connected to the second frequency band microstrip antenna.
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2.
公开(公告)号:US20180331430A1
公开(公告)日:2018-11-15
申请号:US15883673
申请日:2018-01-30
Applicant: AUTEL ROBOTICS CO., LTD.
Inventor: Shengzhao XIANG , Yiye SUN , Zhuanpeng CHENG
CPC classification number: H01Q13/106 , H01Q1/085 , H01Q1/38 , H01Q9/0407 , H01Q13/08 , H01Q21/08
Abstract: The present application relates to the field of communications, and provides an antenna assembly which is disposed in a wireless communications electronic device. The wireless communications electronic device is provided with a substrate. The antenna assembly includes: a radiation element, disposed at a first surface of the radiation element; a feeder, electrically connected to the radiation element; and a reference ground, disposed at a second surface of the substrate. The antenna assembly in the embodiments of the present application uses the substrate of the wireless communications electronic device as a medium to bear the radiation element, reducing space and costs of the antenna assembly; and because the substrate is relatively thick, a bandwidth of the antenna assembly is also increased. The embodiments of the present application further provide a wireless communications electronic device having the antenna assembly.
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