公开(公告)号：US11071239B2

公开(公告)日：2021-07-20

申请号：US16572740

申请日：2019-09-17

申请人： AVX Corporation

发明人： Kwang Choi ,  Marianne Berolini ,  Michael W. Kirk ,  Hector Fuentes ,  Jonathan C. Herr ,  Bryan R. Seither

IPC分类号： H05K7/20 ,  H05K9/00 ,  H03H7/01

摘要： A filter assembly is disclosed that includes a monolithic filter having a surface and a heat sink coupled to the surface of the monolithic filter. The heat sink includes a layer of thermally conductive material that can have a thickness greater than about 0.02 mm. The heat sink may provide electrical shielding for the monolithic filter. In some embodiments, the filter assembly may include an organic dielectric material, such as liquid crystalline polymer or polyphenyl ether. In some embodiments, the filter assembly may include an additional monolithic filter.

公开(公告)号：US12058845B2

公开(公告)日：2024-08-06

申请号：US17344059

申请日：2021-06-10

申请人： AVX Corporation

发明人： Kwang Choi ,  Marianne Berolini ,  Michael W. Kirk ,  Hector Fuentes ,  Jonathan C. Herr ,  Bryan R. Seither

IPC分类号： H05K7/20 ,  H03H7/01 ,  H05K9/00

CPC分类号： H05K7/20918 ,  H03H7/0161 ,  H05K9/0071

摘要： A filter assembly is disclosed that includes a monolithic filter having a surface and a heat sink coupled to the surface of the monolithic filter. The heat sink includes a layer of thermally conductive material that can have a thickness greater than about 0.02 mm. The heat sink may provide electrical shielding for the monolithic filter. In some embodiments, the filter assembly may include an organic dielectric material, such as liquid crystalline polymer or polyphenyl ether. In some embodiments, the filter assembly may include an additional monolithic filter.

公开(公告)号：US20220174848A1

公开(公告)日：2022-06-02

申请号：US17344059

申请日：2021-06-10

申请人： AVX Corporation

发明人： Kwang Choi ,  Marianne Berolini ,  Michael W. Kirk ,  Hector Fuentes ,  Jonathan C. Herr ,  Bryan R. Seither

IPC分类号： H05K7/20 ,  H05K9/00 ,  H03H7/01

摘要： A filter assembly is disclosed that includes a monolithic filter having a surface and a heat sink coupled to the surface of the monolithic filter. The heat sink includes a layer of thermally conductive material that can have a thickness greater than about 0.02 mm. The heat sink may provide electrical shielding for the monolithic filter. In some embodiments, the filter assembly may include an organic dielectric material, such as liquid crystalline polymer or polyphenyl ether. In some embodiments, the filter assembly may include an additional monolithic filter.