公开(公告)号：US11595013B2

公开(公告)日：2023-02-28

申请号：US16720045

申请日：2019-12-19

申请人： AVX Corporation

发明人： Kwang Choi ,  Marianne Berolini

IPC分类号： H03H7/01 ,  H05K1/02 ,  H01F17/00 ,  H05K1/16

摘要： A multilayer electronic device may include a plurality of dielectric layers and a signal path having an input and an output. An inductor may include a conductive layer formed on one of the plurality of dielectric layers and may be electrically connected at a first location with the signal path and electrically connected at a second location with at least one of the signal path or a ground. The inductor may include an outer perimeter that includes a first straight edge facing outward in a first direction and a second straight edge parallel to the first straight edge and facing outward in the first direction. The second straight edge may be offset from the first straight edge by an offset distance that is less than about 500 microns and less than about 90% of a first width of the inductor in the first direction at the first straight edge.

公开(公告)号：US11071239B2

公开(公告)日：2021-07-20

申请号：US16572740

申请日：2019-09-17

申请人： AVX Corporation

发明人： Kwang Choi ,  Marianne Berolini ,  Michael W. Kirk ,  Hector Fuentes ,  Jonathan C. Herr ,  Bryan R. Seither

IPC分类号： H05K7/20 ,  H05K9/00 ,  H03H7/01

摘要： A filter assembly is disclosed that includes a monolithic filter having a surface and a heat sink coupled to the surface of the monolithic filter. The heat sink includes a layer of thermally conductive material that can have a thickness greater than about 0.02 mm. The heat sink may provide electrical shielding for the monolithic filter. In some embodiments, the filter assembly may include an organic dielectric material, such as liquid crystalline polymer or polyphenyl ether. In some embodiments, the filter assembly may include an additional monolithic filter.

公开(公告)号：US11563414B2

公开(公告)日：2023-01-24

申请号：US16720042

申请日：2019-12-19

申请人： AVX Corporation

发明人： Kwang Choi ,  Marianne Berolini

IPC分类号： H03H7/01 ,  H01G4/30 ,  H01G4/005 ,  H01G4/12 ,  H01L49/02 ,  H01G2/06 ,  H05K3/46 ,  H05K1/11 ,  H03H1/00

摘要： A multilayer electronic device may include a plurality of dielectric layers stacked in a Z-direction that is perpendicular to an X-Y plane. The device may include a first conductive layer overlying one of the plurality of dielectric layers. The multilayer electronic device may include a second conductive layer overlying another of the plurality of dielectric layers and spaced apart from the first conductive layer in the Z-direction. The second conductive layer may overlap the first conductive layer in the X-Y plane at an overlapping area to form a capacitor. The first conductive layer may have a pair of parallel edges at a boundary of the overlapping area and an offset edge within the overlapping area that is parallel with the pair of parallel edges. An offset distance between the offset edge and at least one of the pair of parallel edges may be less than about 500 microns.

公开(公告)号：US11190157B2

公开(公告)日：2021-11-30

申请号：US16720038

申请日：2019-12-19

申请人： AVX Corporation

发明人： Kwang Choi ,  Marianne Berolini

IPC分类号： H03H1/00 ,  H03H3/00

摘要： A multilayer filter may include a plurality of dielectric layers stacked in a Z-direction. A first conductive layer may overlie one of the dielectric layers, and a second conductive layer may overlie another of the dielectric layers and be spaced apart from the first conductive layer in the Z-direction. A first via may be connected with the second conductive layer at a first location. A second via may be connected with the second conductive layer at a second location that is spaced apart in a first direction from the first location. The first conductive layer may overlap the second conductive layer at an overlapping area to form a capacitor. At least a portion of the overlapping area may be located between the first location and the second location in the first direction. The second conductive layer may be free of via connections that intersect the overlapping area.

公开(公告)号：US12058845B2

公开(公告)日：2024-08-06

申请号：US17344059

申请日：2021-06-10

申请人： AVX Corporation

发明人： Kwang Choi ,  Marianne Berolini ,  Michael W. Kirk ,  Hector Fuentes ,  Jonathan C. Herr ,  Bryan R. Seither

IPC分类号： H05K7/20 ,  H03H7/01 ,  H05K9/00

CPC分类号： H05K7/20918 ,  H03H7/0161 ,  H05K9/0071

摘要： A filter assembly is disclosed that includes a monolithic filter having a surface and a heat sink coupled to the surface of the monolithic filter. The heat sink includes a layer of thermally conductive material that can have a thickness greater than about 0.02 mm. The heat sink may provide electrical shielding for the monolithic filter. In some embodiments, the filter assembly may include an organic dielectric material, such as liquid crystalline polymer or polyphenyl ether. In some embodiments, the filter assembly may include an additional monolithic filter.

公开(公告)号：US11336249B2

公开(公告)日：2022-05-17

申请号：US16720038

申请日：2019-12-19

申请人： AVX Corporation

发明人： Kwang Choi ,  Marianne Berolini

IPC分类号： H03H1/00 ,  H03H3/00

摘要： A multilayer filter may include a plurality of dielectric layers stacked in a Z-direction. A first conductive layer may overlie one of the dielectric layers, and a second conductive layer may overlie another of the dielectric layers and be spaced apart from the first conductive layer in the Z-direction. A first via may be connected with the second conductive layer at a first location. A second via may be connected with the second conductive layer at a second location that is spaced apart in a first direction from the first location. The first conductive layer may overlap the second conductive layer at an overlapping area to form a capacitor. At least a portion of the overlapping area may be located between the first location and the second location in the first direction. The second conductive layer may be free of via connections that intersect the overlapping area.

公开(公告)号：US11296669B2

公开(公告)日：2022-04-05

申请号：US16720038

申请日：2019-12-19

申请人： AVX Corporation

发明人： Kwang Choi ,  Marianne Berolini

IPC分类号： H03H1/00 ,  H03H3/00

摘要： A multilayer filter may include a plurality of dielectric layers stacked in a Z-direction. A first conductive layer may overlie one of the dielectric layers, and a second conductive layer may overlie another of the dielectric layers and be spaced apart from the first conductive layer in the Z-direction. A first via may be connected with the second conductive layer at a first location. A second via may be connected with the second conductive layer at a second location that is spaced apart in a first direction from the first location. The first conductive layer may overlap the second conductive layer at an overlapping area to form a capacitor. At least a portion of the overlapping area may be located between the first location and the second location in the first direction. The second conductive layer may be free of via connections that intersect the overlapping area.

公开(公告)号：US11114994B2

公开(公告)日：2021-09-07

申请号：US16718255

申请日：2019-12-18

申请人： AVX Corporation

发明人： Kwang Choi ,  Marianne Berolini

IPC分类号： H03H7/01 ,  H03H1/00 ,  H03H3/00

摘要： A multilayer filter may include a dielectric layer having a top surface, a bottom surface, and a thickness in a Z-direction between the top surface and the bottom surface. The multilayer filter may include a conductive layer formed on the top surface of the dielectric layer. The multilayer filter may include a via assembly formed in the dielectric layer and connected to the conductive layer on the top surface of the dielectric layer. The via assembly may extend to the bottom surface of the dielectric layer. The via assembly may have a length in the Z-direction and a total cross-sectional area in an X-Y plane that is perpendicular to the Z-direction. The via assembly may have an area-to-squared-length ratio that is greater than about 3.25.

公开(公告)号：US20220174848A1

公开(公告)日：2022-06-02

申请号：US17344059

申请日：2021-06-10

申请人： AVX Corporation

发明人： Kwang Choi ,  Marianne Berolini ,  Michael W. Kirk ,  Hector Fuentes ,  Jonathan C. Herr ,  Bryan R. Seither

IPC分类号： H05K7/20 ,  H05K9/00 ,  H03H7/01

摘要： A filter assembly is disclosed that includes a monolithic filter having a surface and a heat sink coupled to the surface of the monolithic filter. The heat sink includes a layer of thermally conductive material that can have a thickness greater than about 0.02 mm. The heat sink may provide electrical shielding for the monolithic filter. In some embodiments, the filter assembly may include an organic dielectric material, such as liquid crystalline polymer or polyphenyl ether. In some embodiments, the filter assembly may include an additional monolithic filter.

公开(公告)号：US11838002B2

公开(公告)日：2023-12-05

申请号：US17460729

申请日：2021-08-30

申请人： AVX Corporation

发明人： Kwang Choi ,  Marianne Berolini

IPC分类号： H03H7/01 ,  H03H1/00 ,  H03H3/00

CPC分类号： H03H7/0115 ,  H03H1/00 ,  H03H3/00 ,  H03H7/1725 ,  H03H7/1766 ,  H03H7/1775 ,  H03H2001/0085

摘要： A high frequency multilayer filter may include a plurality of dielectric layers and a signal path having an input and an output. The multilayer filter may include an inductor including a conductive layer formed over a first dielectric layer. The inductor may be electrically connected at a first location with the signal path and electrically connected at a second location with at least one of the signal path or a ground. The multilayer filter may include a capacitor including a first electrode and a second electrode that is separated from the first electrode by a second dielectric layer. The multilayer filter has a characteristic frequency that is greater than about 6 GHz.