公开(公告)号：US20060086713A1

公开(公告)日：2006-04-27

申请号：US10974003

申请日：2004-10-26

申请人： Aaron Hunter ,  Rajesh Ramanujam ,  Balasubramanian Ramachandran ,  Cornia Tanasa ,  Tarpan Dixit

发明人： Aaron Hunter ,  Rajesh Ramanujam ,  Balasubramanian Ramachandran ,  Cornia Tanasa ,  Tarpan Dixit

IPC分类号： A21B1/00 ,  A21B1/22 ,  F27D11/00

CPC分类号： F27B17/0025 ,  F27B5/04 ,  F27D21/0014 ,  H01L21/67115 ,  H01L21/67248 ,  H05B3/68

摘要： A rapid thermal processing (RTP) system including a transmission pyrometer monitoring the temperature dependent absorption of the silicon wafer for radiation from the RTP lamps at a reduced power level. A look-up table is created relating unnormalized values of photodetector photocurrents with wafer and radiant lamp temperatures. A calibrating step measures the photocurrent with known wafer and lamp temperatures and all photocurrents measured thereafter are accordingly normalized. The transmission pyrometer may be used for closed loop control for thermal treatments below 500° C. or used in the pre-heating phase for a higher temperature process including radiation pyrometry in closed loop control. The pre-heating temperature ramp rate may be controlled by measuring the initial ramp rate and readjusting the lamp power accordingly. Radiation and transmission pyrometers may be included in an integrated structure with a beam splitter dividing radiation from the wafer.

公开(公告)号：US08222574B2

公开(公告)日：2012-07-17

申请号：US12055045

申请日：2008-03-25

申请人： Khurshed Sorabji ,  Alexander Lerner ,  Joseph Ranish ,  Aaron Hunter ,  Bruce Adams ,  Mehran Behdjat ,  Rajesh Ramanujam

发明人： Khurshed Sorabji ,  Alexander Lerner ,  Joseph Ranish ,  Aaron Hunter ,  Bruce Adams ,  Mehran Behdjat ,  Rajesh Ramanujam

IPC分类号： H05B3/68 ,  F26B3/30 ,  C23C16/00

CPC分类号： H01L21/67109 ,  H01L21/67115 ,  H01L21/67248

摘要： Apparatus and methods for achieving uniform heating or cooling of a substrate during a rapid thermal process are disclosed. More particularly, apparatus and methods for controlling the temperature of an edge ring supporting a substrate and/or a reflector plate during a rapid thermal process to improve temperature uniformity across the substrate are disclosed, which include a thermal mass or plate adjacent the edge ring to heat or cool the edge ring.

摘要翻译： 公开了用于在快速热处理期间实现基板的均匀加热或冷却的装置和方法。 更具体地，公开了用于在快速热处理期间控制支撑衬底和/或反射板的边缘环的温度以改善衬底上的温度均匀性的装置和方法，其包括邻近边缘环到 加热或冷却边缘环。