APPARATUS AND SYSTEM FOR COOLING
    1.
    发明公开

    公开(公告)号:US20230389236A1

    公开(公告)日:2023-11-30

    申请号:US18042090

    申请日:2021-08-10

    申请人: Accelsius, LLC

    IPC分类号: H05K7/20

    CPC分类号: H05K7/208 H05K7/20836

    摘要: A cooling apparatus includes thermosyphon loops for cooling multiple electronic devices. Each of the thermosyphon loops includes at least one evaporator and at least one condenser. Sensors within the thermosyphon loop measure can measure various parameters such as vapour quality within an inlet and outlet of at least one of the evaporators, total heat load of at least one of the evaporators; and the liquid level in a downcomer of the thermosyphon loop.

    Heat Exchangers and Methods of Forming Heat Exchangers

    公开(公告)号:US20240102749A1

    公开(公告)日:2024-03-28

    申请号:US18257397

    申请日:2021-11-19

    申请人: Accelsius , LLC

    IPC分类号: F28F9/26

    摘要: Examples of the disclosure relate to heat exchangers. The heat exchangers could be evaporators or condensers. The heat exchangers can comprise a plurality of structures extending from a base plate where adjacent structures are separated by at least a first distance. The heat exchangers can also comprise at least one cover plate positioned over ends of the plurality of structures so that the at least one cover plate is spaced from the ends of the plurality of structures by a second distance where the second distance is smaller than the first distance. The at least one cover plate is brazed to the plurality of structures by brazing material provided between the ends of the plurality of structures and the at least one cover plate. The brazing material is provided in a discontinuous configuration so that gaps are provided between portions of brazing material so that a brazing join is formed from brazing materials that has flowed into spacing between the at least one cover plate and the ends of the plurality of structures.

    Cooling systems and heat exchangers
    3.
    发明公开

    公开(公告)号:US20240044583A1

    公开(公告)日:2024-02-08

    申请号:US18257433

    申请日:2021-12-07

    申请人: Accelsius, LLC

    IPC分类号: F28D15/02

    摘要: Examples of the disclosure relate to heat exchangers. The heat exchangers can comprise a plurality of channels configured for flow of working fluid. The plurality of channels can be configured to move between a non-expanded configuration and an expanded configuration such that, in the non-expanded configuration the plurality of channels are sized so as to allow for movement of the heat exchanger relative to one or more heat sources and in the expanded configuration the plurality of channels are sized so as to restrict movement of the heat exchanger relative to the one or more heat sources. The plurality of channels are configured so that changes in internal pressure of the working fluid causes the plurality of channels to move between the non-expanded configuration and the expanded configuration.