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公开(公告)号：US07084010B1
公开(公告)日：2006-08-01
申请号：US10688708
申请日：2003-10-17
IPC分类号： H01L21/44
CPC分类号： G01J5/04 , G01J5/045 , G01J5/046 , G01J5/0875 , H01L27/14618 , H01L31/0203 , H01L2224/73265 , H01L2924/01327 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A radiation detector (10) has a base (30), a frame (48), a window (46), and solder layers (50, 52) formed from a solder pre-form (58, 60) to define a vacuum chamber (56). Feedthroughs (18, 40, 44) penetrate the base (30) for electrical connection to internal components. A method for sealing the detector (10) aligns a lower detector assembly (62), the frame (48) the window (46), and the solder pre-forms (58, 60) in a non-sealed relation within a processing chamber (80, 94). High temperature and low pressure is imposed, and the getter (42) is activated by resistive heating imposed by current leads (88). The window (46), frame (48), and lower detector assembly (62) are then pressed together and sealed by the liquefied solder pre-forms (58, 60). The method eliminates the need for a seal port, combines several steps within the processing chamber (80, 94), and eliminates certain prior art cleaning steps.
摘要翻译： 辐射检测器（10）具有基底（30），框架（48），窗口（46）以及由焊料预成型件（58,60）形成的焊料层（50,52），以限定真空室 （56）。 馈通（18,40,44）穿透基座（30）以与内部部件电连接。 用于密封检测器（10）的方法将下检测器组件（62），框架（48）窗口（46）和焊料预成型件（58,60）以非密封关系对准处理室 （80,94）。 施加高温和低压，并且吸气剂（42）由电流引线（88）施加的电阻加热激活。 然后将窗（46），框架（48）和下检测器组件（62）压在一起并通过液化的焊料预成型件（58,60）密封。 该方法消除了对密封端口的需要，结合了处理室（80,94）内的几个步骤，并且消除了某些现有技术的清洁步骤。
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公开(公告)号：US20050054212A1
公开(公告)日：2005-03-10
申请号：US10968588
申请日：2004-10-19
摘要： A method for manufacturing optically-transparent lids includes etching sub-wavelength structures on a surface of a lid wafer. The structures may be arrayed in a hexagonally closed-packed pattern.
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