公开(公告)号：US20240030507A1

公开(公告)日：2024-01-25

申请号：US17870118

申请日：2022-07-21

Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

Inventor： Roger M. Brisbane ,  Paul R. Campbell ,  Seth P. Mansfield

IPC: H01M10/48 ,  H01M50/249 ,  H01M50/287 ,  G01J5/04

CPC classification number: H01M10/486 ,  H01M10/482 ,  H01M50/249 ,  H01M50/287 ,  G01J5/045 ,  H01M2220/20

Abstract: A cell temperature measurement system for a battery module is described. The system may include a cell monitoring unit (CMU) configured to generate temperature measurements for a plurality of battery cells included as part of the battery module according to contactless, optical, or line-of-sight measurements made with one or more sensors associated with a temperature measurement device.

公开(公告)号：US11815400B2

公开(公告)日：2023-11-14

申请号：US17058484

申请日：2019-05-28

Applicant: COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIES ALTERNATIVES

Inventor： Abdelkader Aliane ,  Alain Charpentier

IPC: G01J5/20 ,  G01J5/02 ,  G01J5/80 ,  G01J5/04 ,  G01J5/06 ,  H04N5/33

CPC classification number: G01J5/20 ,  G01J5/024 ,  G01J5/045 ,  G01J5/064 ,  G01J5/80 ,  H04N5/33

Abstract: A detection system includes a readout substrate, at least one thermal detector associated with a reflector, and at least one compensation device including a compensation transducer in thermal contact with the readout substrate, arranged between the reflector and the readout substrate, and situated facing the reflector so as to be optically insensitive to the incident electromagnetic radiation.

公开(公告)号：US11808633B2

公开(公告)日：2023-11-07

申请号：US17403117

申请日：2021-08-16

Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.

Inventor： Chein-Hsun Wang ,  Da-Jun Lin ,  Chun-Chiang Chen ,  Chih-Yung Tsai ,  Yu-Chih Liang ,  Ming Le ,  Chen-Tang Huang ,  Tung-Yang Lee ,  Jenping Ku

IPC: G01J5/00 ,  G01J5/14 ,  G01J5/02 ,  G01K7/06 ,  G01K7/02 ,  G01J5/04 ,  H10N10/817

CPC classification number: G01J5/14 ,  G01J5/025 ,  G01J5/045 ,  G01K7/028 ,  G01K7/06 ,  H10N10/817

Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. The conversion from wrist temperature to body core temperature uses detected ambient temperature and fixed humidity or imported humidity level to calculate the body core temperature based on experimental data and curve fitting. The skin temperature compensation can be set differently for different sex gender, different standard deviation of wrist temperature and external relative humidity reading.

公开(公告)号：US20190219449A1

公开(公告)日：2019-07-18

申请号：US16365026

申请日：2019-03-26

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Koichi KUSUKAME ,  Nawatt SILAWAN ,  Aki YONEDA

IPC: G01J5/20 ,  G01J5/08 ,  G01J5/04 ,  G01J5/02

CPC classification number: G01J5/20 ,  G01J5/0205 ,  G01J5/04 ,  G01J5/045 ,  G01J5/047 ,  G01J5/048 ,  G01J5/0806 ,  G01J5/089 ,  G01J2005/202

Abstract: An infrared detecting device includes: an infrared sensor that has one or more infrared detection elements arranged in one or more columns; and an IC chip that performs signal processing on a signal output from the infrared sensor. The infrared sensor and the IC chip are generally juxtaposed in a direction along a scan rotation axis of the infrared sensor.

公开(公告)号：US20180226530A1

公开(公告)日：2018-08-09

申请号：US15939636

申请日：2018-03-29

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Hartmut Rudmann ,  Markus Rossi

IPC: H01L31/16 ,  H01L31/167 ,  G01J1/02 ,  G01J1/04 ,  G01J1/06 ,  H01L31/0232 ,  H01L27/146 ,  H01L25/16 ,  G02B13/00 ,  G02B3/00 ,  G01J5/20 ,  G01J5/08 ,  G01J5/04 ,  G01J5/02 ,  G01J5/00 ,  G01J1/42 ,  B29D11/00

CPC classification number: H01L31/16 ,  B29D11/00298 ,  B29D11/00307 ,  G01J1/0209 ,  G01J1/0233 ,  G01J1/0271 ,  G01J1/0411 ,  G01J1/06 ,  G01J1/42 ,  G01J5/00 ,  G01J5/022 ,  G01J5/0235 ,  G01J5/024 ,  G01J5/0265 ,  G01J5/045 ,  G01J5/0806 ,  G01J5/20 ,  G01J2001/061 ,  G02B3/0031 ,  G02B3/0056 ,  G02B13/0085 ,  H01L25/167 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14687 ,  H01L31/02325 ,  H01L31/167 ,  H01L2924/0002 ,  Y10T29/49002 ,  H01L2924/00

Abstract: Manufacturing opto-electronic modules (1) includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack (2) in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules (1) can be obtained by separating the wafer stack (2) into separate modules.

公开(公告)号：US09989409B2

公开(公告)日：2018-06-05

申请号：US14964927

申请日：2015-12-10

Applicant: MELEXIS TECHNOLOGIES NV

Inventor： Appolonius Jacobus Van Der Wiel

IPC: G01J1/42 ,  G01J1/16 ,  G01J5/02 ,  G01J5/04 ,  G01J5/06 ,  G01J5/12 ,  G01J5/14 ,  G01J5/20

CPC classification number: G01J1/4228 ,  G01J1/1626 ,  G01J5/0225 ,  G01J5/024 ,  G01J5/0285 ,  G01J5/045 ,  G01J5/06 ,  G01J5/061 ,  G01J5/12 ,  G01J5/14 ,  G01J5/20 ,  G01J2005/0048 ,  G01J2005/063 ,  G01J2005/065 ,  G01J2005/066 ,  G01J2005/068

Abstract: A semiconductor device for measuring IR radiation is disclosed. It comprises a substrate and a cap enclosing a cavity, a sensor pixel in the cavity, comprising a first absorber for receiving said IR radiation, a first heater, first temperature measurement means for measuring a first temperature; a reference pixel in the same cavity, comprising a second absorber shielded from said IR radiation, a second heater, and second temperature measurement means for measuring a second temperature; a control circuit for applying a first/second power to the first/second heater such that the first temperature equals the second temperature; and an output circuit for generating an output signal indicative of the IR radiation based on a difference between the first and second power.

公开(公告)号：US09929196B2

公开(公告)日：2018-03-27

申请号：US15400278

申请日：2017-01-06

Applicant: Ulis ,  Commissariat A L'Energie Atomique Et Aux Energies Alternatives

Inventor： Michel Vilain ,  Jérôme Favier ,  Jean-Jacques Yon ,  Laurent Frey

IPC: G01J5/20 ,  G01J5/02 ,  H01L27/146 ,  G01J5/04

CPC classification number: H01L27/14618 ,  G01J5/024 ,  G01J5/045 ,  G01J5/20 ,  G01J2005/204 ,  H01L27/1462 ,  H01L27/14629 ,  H01L27/14649 ,  H01L27/14685 ,  H01L27/14687

Abstract: A method of manufacturing a detector capable of detecting a wavelength range [λ8; λ14] centered on a wavelength λ10, including: forming said device on a substrate by depositing a sacrificial layer totally embedding said device; forming, on the sacrificial layer, a cap including first, second, and third optical structures transparent in said range [Δ8; λ14], the second and third optical structures having equivalent refraction indexes at wavelength λ10 respectively greater than or equal to 3.4 and smaller than or equal to 2.3; forming a vent of access to the sacrificial layer through a portion of the cap, and then applying, through the vent, an etching to totally remove the sacrificial layer.

公开(公告)号：US09857229B1

公开(公告)日：2018-01-02

申请号：US15188116

申请日：2016-06-21

Applicant: MP High Tech Solutions Pty Ltd

Inventor： Marek Steffanson

IPC: H01L21/00 ,  G01J5/10 ,  B81C1/00

CPC classification number: G01J5/10 ,  B81C1/00142 ,  B81C1/0019 ,  B81C2201/0132 ,  G01J5/045 ,  G01J5/0806 ,  G01J5/40

Abstract: A method of fabricating electromagnetic radiation detection devices including: forming a first mask on a substrate; forming a structural layer on the substrate using the first mask; forming a metallic layer overlying the structural layer; removing the first mask; forming a second mask on the substrate, the second mask comprising mask openings; selectively patterning the metallic layer using the mask openings; and removing the second mask.

公开(公告)号：US09851258B2

公开(公告)日：2017-12-26

申请号：US14671007

申请日：2015-03-27

Applicant: Maxim Integrated Products, Inc.

Inventor： Cheng-Wei Pei ,  Craig A. Easson ,  Arvin Emadi ,  Nicole D. Kerness ,  Stanley Barnett

IPC: G01J5/00 ,  G01J5/12 ,  G01J5/04 ,  G01J5/06

CPC classification number: G01J5/12 ,  G01J5/045 ,  G01J5/06 ,  G01J2005/068

Abstract: A sensor package having a thermopile sensor and a reference thermopile sensor disposed therein. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, and a lid assembly disposed over the thermopile sensor and the reference thermopile sensor. The lid assembly includes a transparent structure that passes electromagnetic radiation occurring in a limited spectrum of wavelengths and an electromagnetic blocker disposed over the lid assembly. The electromagnetic blocker defines an aperture over the thermopile sensor such that at least a portion of the electromagnetic blocker is positioned over the reference thermopile sensor. The electromagnetic blocker is configured to at least substantially block the electromagnetic radiation occurring in a limited spectrum of wavelengths from reaching the reference thermopile sensor.

公开(公告)号：US09748214B2

公开(公告)日：2017-08-29

申请号：US14887294

申请日：2015-10-19

Applicant: Joseph Donald LaVeigne

Inventor： Joseph Donald LaVeigne

IPC: H01L25/16 ,  G01J1/44 ,  H01L27/146 ,  H01L31/18 ,  H01L33/00 ,  H01L33/62 ,  G01J5/02 ,  G01J5/20 ,  G01J5/04 ,  G01J5/10

CPC classification number: H01L25/167 ,  G01J1/44 ,  G01J5/02 ,  G01J5/024 ,  G01J5/045 ,  G01J5/20 ,  G01J2005/106 ,  G01J2005/202 ,  H01L27/14649 ,  H01L31/186 ,  H01L33/0095 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  Y10T29/49002 ,  Y10T29/49117 ,  H01L2924/00

Abstract: A first substrate having an array of emitters or detectors may be joined by bump bonding with a second substrate having read-in (RIIC) or read-out (ROIC) circuitry. After the two substrates are joined, the resulting assembly may be singulated to form sub-arrays such as tiles sub-arrays having pixel elements which may be arranged on a routing layer or carrier to form a larger array. Edge features of the tiles may provide for physical alignment, mechanical attachment and chip-to-chip communication. The pixel elements may be thermal emitter elements for IR image projectors, thermal detector elements for microbolometers, LED-based emitters, or quantum photon detectors such as those found in visible, infrared and ultraviolet FPAs (focal plane arrays), and the like.