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1.发明申请USING A MULTI-CHIP SYSTEM IN A PACKAGE (MCSiP) IN IMAGING APPLICATIONS TO YIELD A LOW COST, SMALL SIZE CAMERA ON A CHIP 审中-公开在包装中使用多芯片系统（MCSiP）在成像应用中成本低成本，小尺寸相机在芯片上公开(公告)号：US20120281113A1
公开(公告)日：2012-11-08
申请号：US13164432
申请日：2011-06-20
CPC分类号： H04N5/2257 , H01L27/14618 , H01L2224/48091 , H01L2224/48465 , H04N5/33 , H04N5/335 , H01L2924/00014 , H01L2924/00
摘要： According to some embodiments, a camera includes a multi-chip system in a package (MCSiP). The MCSiP comprising a set of electronics, an encapsulate, and a plurality of interconnects. The set of electronics includes a plurality of bare integrated circuit dies and other passive or active electronic components. Each die is operable to provide a functional component of a computing system operable to receive a signal describing electromagnetic radiation detected by an imaging sensor and facilitate generating an image according to the signal. The encapsulate comprises an adhesive molding compound deposited outwardly from the set of electronics in order to hold the set of electronics in position. The interconnects communicatively couple each die to other dies, the other electronic components, or components external to the MCSiP.
摘要翻译： 根据一些实施例，相机包括封装（MCSiP）中的多芯片系统。 MCSiP包括一组电子器件，封装和多个互连。 该组电子器件包括多个裸露集成电路管芯和其它无源或有源电子部件。 每个管芯可操作以提供计算系统的功能部件，其可操作以接收描述由成像传感器检测到的电磁辐射的信号，并且便于根据该信号生成图像。 包封物包括从该组电子装置向外沉积的粘合剂模塑料，以便将该组电子器件保持就位。 互连通信地将每个管芯耦合到其它管芯，其它电子部件或MCSiP外部的部件。
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公开(公告)号：US20120169884A1
公开(公告)日：2012-07-05
申请号：US12643361
申请日：2009-12-21
CPC分类号： H04N5/2254 , G01J1/0266 , G01J1/0437 , G01J1/044 , G01J1/0448 , G01J5/0831 , G01J5/0834 , G01J5/084 , G01J5/089 , H04N5/33
摘要： In certain embodiments, a detection device includes a structure having an entrance that permits radiation to enter the structure and a radiation detector operable to detect radiation that enters the structure. The device also includes a microshutter array coupled to the structure and aligned with the entrance, the array comprising a plurality of microshutter cells operable to move between a first position in which that microshutter cell prevents radiation of a first wavelength from passing through a portion of the entrance and a second position in which that microshutter cell permits the radiation of the first wavelength to pass through the portion of the entrance. The device further includes an actuating device operable to define a first entrance pupil having a first f-number by moving a plurality of microshutter cells associated with the first f-number.
摘要翻译： 在某些实施例中，检测装置包括具有允许辐射进入结构的入口的结构和可操作以检测进入结构的辐射的辐射检测器。 该装置还包括耦合到结构并与入口对准的微型振荡器阵列，该阵列包括多个微型振荡器单元，可操作以在第一位置之间移动，在该第一位置，该微型振荡器单元防止第一波长的辐射通过 入口和第二位置，在该第二位置，该微切口单元允许第一波长的辐射通过入口的该部分。 该装置还包括致动装置，其可操作以通过移动与第一f-号码相关联的多个微振槽单元来限定具有第一f号码的第一入射光瞳。
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公开(公告)号：US07084010B1
公开(公告)日：2006-08-01
申请号：US10688708
申请日：2003-10-17
IPC分类号： H01L21/44
CPC分类号： G01J5/04 , G01J5/045 , G01J5/046 , G01J5/0875 , H01L27/14618 , H01L31/0203 , H01L2224/73265 , H01L2924/01327 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A radiation detector (10) has a base (30), a frame (48), a window (46), and solder layers (50, 52) formed from a solder pre-form (58, 60) to define a vacuum chamber (56). Feedthroughs (18, 40, 44) penetrate the base (30) for electrical connection to internal components. A method for sealing the detector (10) aligns a lower detector assembly (62), the frame (48) the window (46), and the solder pre-forms (58, 60) in a non-sealed relation within a processing chamber (80, 94). High temperature and low pressure is imposed, and the getter (42) is activated by resistive heating imposed by current leads (88). The window (46), frame (48), and lower detector assembly (62) are then pressed together and sealed by the liquefied solder pre-forms (58, 60). The method eliminates the need for a seal port, combines several steps within the processing chamber (80, 94), and eliminates certain prior art cleaning steps.
摘要翻译： 辐射检测器（10）具有基底（30），框架（48），窗口（46）以及由焊料预成型件（58,60）形成的焊料层（50,52），以限定真空室 （56）。 馈通（18,40,44）穿透基座（30）以与内部部件电连接。 用于密封检测器（10）的方法将下检测器组件（62），框架（48）窗口（46）和焊料预成型件（58,60）以非密封关系对准处理室 （80,94）。 施加高温和低压，并且吸气剂（42）由电流引线（88）施加的电阻加热激活。 然后将窗（46），框架（48）和下检测器组件（62）压在一起并通过液化的焊料预成型件（58,60）密封。 该方法消除了对密封端口的需要，结合了处理室（80,94）内的几个步骤，并且消除了某些现有技术的清洁步骤。
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4.发明授权Method and apparatus providing focal plane array active thermal control elements 有权提供焦平面阵列有源热控元件的方法和装置公开(公告)号：US06649913B1
公开(公告)日：2003-11-18
申请号：US10084687
申请日：2002-02-26
IPC分类号： G01J500
摘要： A focal plane array (FPA) of infrared (IR) radiation detectors (20), such as an array of microbolometers, includes an active area (20A) containing a plurality of IR radiation detectors, a readout integrated circuit (ROIC) (12) that is mechanically and electrically coupled to the active area and, disposed on the ROIC, a plurality of heater elements (30A) that are located and operated so as to provide a substantially uniform thermal distribution across at least the active area. The FPA further includes a plurality of temperature sensors (30B), individual ones of which are spatially associated with one of the heater elements for sensing the temperature in the vicinity of the associated heater element for providing closed loop operation of the associated heater element. In one embodiment pairs of the heater elements and associated temperature sensors are distributed in a substantially uniform manner across at least a top or a bottom surface of the ROIC, while in another embodiment pairs of the heater elements and associated temperature sensors, or only the heater elements, are distributed in accordance with a predetermined thermal profile of the FPA. The plurality of heater elements may each be composed of a silicon resistance, and the plurality of temperature sensors may each be each composed of a silicon temperature sensor.
摘要翻译： 红外线（IR）辐射探测器（20）的焦平面阵列（FPA），例如微电流计阵列，包括一个包含多个红外辐射探测器的有源区域（20A），一个读出集成电路（ROIC） 机械地和电耦合到有源区域，并且设置在ROIC上，多个加热器元件（30A）被定位和操作以便在至少有效区域上提供基本均匀的热分布。 FPA还包括多个温度传感器（30B），其中单独的温度传感器在空间上与一个加热器元件相关联，用于感测相关联的加热器元件附近的温度，以提供相关加热器元件的闭环操作。 在一个实施例中，成对的加热器元件和相关联的温度传感器以基本上均匀的方式分布在ROIC的至少顶部或底部表面上，而在另一个实施例中，加热器元件和相关联的温度传感器对，或仅加热器 元件，根据FPA的预定热剖面分布。 多个加热器元件可以各自由硅电阻组成，并且多个温度传感器可以各自由硅温度传感器组成。
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公开(公告)号：US6107216A
公开(公告)日：2000-08-22
申请号：US989288
申请日：1997-12-12
CPC分类号： F25D19/006 , B32B15/08
摘要： A structure (20) is formed of a first article (22) such as a cold finger (82), a second article (24) such as an electronic component (78) to be affixed to and cooled by the cold finger (82), and a bonding element (26) disposed between and bonding together the first article (22) and the second article (24). The bonding element (26) includes a porous metallic body (28), such as a screen, a mesh, a felt, or a foam, and a mass of resin adhesive (36) impregnated into the metallic body (28). The mass of adhesive (36) contacts and bonds to the first article (22) and to the second article (24), and the porous metallic body (28) forms a substantially continuous, high-conductivity path between the first article (22) and the second article (24).
摘要翻译： 结构（20）由诸如冷指（82）的第一制品（22），诸如电子部件（78）的第二制品（24）形成，以固定并由冷指（82）冷却， ，以及设置在第一制品（22）和第二制品（24）之间并将其结合在一起的结合元件（26）。 接合元件（26）包括浸渍在金属体（28）中的多孔金属体（28），例如筛网，网，毡或泡沫，以及大量的树脂粘合剂（36）。 粘合剂（36）的质量与第一制品（22）和第二制品（24）接触并结合，多孔金属体（28）在第一制品（22）和第二制品 和第二条（24）。
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公开(公告)号：US09091748B2
公开(公告)日：2015-07-28
申请号：US13449637
申请日：2012-04-18
CPC分类号： H04N13/20 , G01S7/4802 , G01S7/4861 , G01S17/89
摘要： A 3D ultraviolet (UV) imaging LADAR system includes a UV source configured to generate a UV interrogation beam, a sensor configured to receive a UV return beam reflected from a target and to produce an electrical signal, and an imaging module coupled to the sensor and configured to receive the electrical signal and to generate a corresponding 3D image of the target. In one example, the sensor includes a down-shifting device configured to down-shift the UV return beam to a down-shifted light beam of a different wavelength, for example, in the visible or SWIR wavelength ranges.
摘要翻译： 3D紫外（UV）成像LADAR系统包括被配置为产生UV询问光束的UV源，被配置为接收从目标物反射并产生电信号的UV返回光束的传感器，以及耦合到传感器的成像模块， 被配置为接收电信号并产生目标的相应3D图像。 在一个示例中，传感器包括下移装置，其被配置为将UV返回光束向下移位到例如在可见光或SWIR波长范围内的不同波长的向下移动的光束。
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公开(公告)号：US08928883B1
公开(公告)日：2015-01-06
申请号：US12948485
申请日：2010-11-17
申请人： Frank B. Jaworski , Justin Gordon Adams Wehner , Adam M. Kennedy , Darin S. Williams , Anuradha Murthy Agarwal , Juejun Hu
发明人： Frank B. Jaworski , Justin Gordon Adams Wehner , Adam M. Kennedy , Darin S. Williams , Anuradha Murthy Agarwal , Juejun Hu
IPC分类号： G01N21/00
CPC分类号： G01N21/7746 , G01N2021/7776
摘要： In certain embodiments, a system for detecting an agent includes a resonator device configured to receive an agent. The resonator device is also configured to transmit light received from a light source, the transmitted light having an altered peak wavelength due to the presence of the received agent. The system further includes a filter device configured to filter the transmitted light having the altered peak wavelength such that the transmitted light having the altered peak wavelength does not reach one or more detectors of a detector array configured to receive transmitted light not filtered by the filter device. The system further includes a processing system operable to determine that the one or more detectors of the detector array are not generating a signal, the absence of the signal being generated by the one or more detectors of the detector array indicating the presence of the agent.
摘要翻译： 在某些实施例中，用于检测代理的系统包括被配置为接收代理的谐振器装置。 谐振器装置还被配置为透射从光源接收的光，由于接收到的代理的存在，透射光具有改变的峰值波长。 该系统还包括滤波器装置，该滤波器装置被配置为对具有改变的峰值波长的透射光进行滤波，使得具有改变的峰值波长的透射光未达到检测器阵列的一个或多个检测器，其被配置为接收未被滤波器装置滤波的透射光 。 系统还包括处理系统，其可操作以确定检测器阵列的一个或多个检测器不产生信号，由检测器阵列的一个或多个检测器产生的信号的不存在指示代理的存在。
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公开(公告)号：US20130278716A1
公开(公告)日：2013-10-24
申请号：US13449637
申请日：2012-04-18
IPC分类号： H01L27/146 , H04N13/02
CPC分类号： H04N13/20 , G01S7/4802 , G01S7/4861 , G01S17/89
摘要： A 3D ultraviolet (UV) imaging LADAR system includes a UV source configured to generate a UV interrogation beam, a sensor configured to receive a UV return beam reflected from a target and to produce an electrical signal, and an imaging module coupled to the sensor and configured to receive the electrical signal and to generate a corresponding 3D image of the target. In one example, the sensor includes a down-shifting device configured to down-shift the UV return beam to a down-shifted light beam of a different wavelength, for example, in the visible or SWIR wavelength ranges.
摘要翻译： 3D紫外（UV）成像LADAR系统包括被配置为产生UV询问光束的UV源，被配置为接收从目标物反射并产生电信号的UV返回光束的传感器，以及耦合到传感器的成像模块， 被配置为接收电信号并产生目标的相应3D图像。 在一个示例中，传感器包括下移装置，其被配置为将UV返回光束向下移位到例如在可见光或SWIR波长范围内的不同波长的向下移动的光束。
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公开(公告)号：US08389947B2
公开(公告)日：2013-03-05
申请号：US13169389
申请日：2011-06-27
IPC分类号： G01T3/00
CPC分类号： G01T3/04
摘要： A method for detecting neutron radiation in accordance with particular embodiments includes exposing a neutron detector array comprising at least one two-dimensional array of neutron detectors to a first scene of interest. The neutron detector array is based on at least one two-dimensional array of microbolometer detectors. The method also includes receiving a plurality of response values from a corresponding plurality of neutron detectors of the neutron detector array. The method further includes generating a comparison value based on the plurality of response values and a baseline response value. The method additionally, includes determining whether more than a first threshold amount of neutron radiation is being generated by the first scene based on the comparison value.
摘要翻译： 根据特定实施例的用于检测中子辐射的方法包括将包括至少一个二维中子探测器阵列的中子探测器阵列暴露于感兴趣的第一场景。 中子探测器阵列基于至少一个二维微阵列检测器阵列。 该方法还包括从中子检测器阵列的相应多个中子检测器接收多个响应值。 该方法还包括基于多个响应值和基线响应值来生成比较值。 该方法另外包括基于比较值确定是否由第一场景产生多于第一阈值量的中子辐射。
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10.发明授权Sensor/support system having a stabilization structure affixed to a side of a platform oppositely disposed from a sensor assembly 有权传感器/支撑系统具有固定在与传感器组件相对设置的平台侧的稳定结构公开(公告)号：US06417514B1
公开(公告)日：2002-07-09
申请号：US09502193
申请日：2000-02-10
申请人： Arthur A. Eneim , Adam M. Kennedy , Monesh S. Patel , Farhad I. Mirbod , Janine F. Lambe , Kenneth L. McAllister , Stephen R. Gibbs
发明人： Arthur A. Eneim , Adam M. Kennedy , Monesh S. Patel , Farhad I. Mirbod , Janine F. Lambe , Kenneth L. McAllister , Stephen R. Gibbs
IPC分类号： G01J516
CPC分类号： H01L27/14636 , H01L27/1465 , H01L31/024 , H01L2924/351
摘要： A sensor/support system includes a sensor assembly having a planar radiation detector lying parallel to a reference plane, a readout circuit, and an interconnect joining the radiation detector to the readout circuit. The system further includes a support structure, the support structure having a platform with a first side to which the sensor assembly is affixed and a second side oppositely disposed from the first side. A shim is affixed to the second side of the platform. The shim is made of a shim material different from the detector material and the platform material. The shim reduces the strain in the interconnect when the temperature of the sensor/support system is changed, as compared with the strain in the interconnect in the absence of the stabilization structure. The shim is selected such that an in-plane strain in the interconnect, measured parallel to the reference plane, during a required thermal excursion is less than a maximum strain difference over the thermal excursion for the interconnect material in low-cycle fatigue for a design number of cycles evaluated over the required thermal excursion.
摘要翻译： 传感器/支撑系统包括具有平行于参考平面的平面辐射检测器的传感器组件，读出电路和将辐射检测器连接到读出电路的互连。 所述系统还包括支撑结构，所述支撑结构具有平台，所述平台具有固定有所述传感器组件的第一侧，以及与所述第一侧相对设置的第二侧。 平台的第二侧贴有垫片。 垫片由不同于检测器材料和平台材料的垫片材料制成。 当传感器/支撑系统的温度改变时，与没有稳定结构的互连中的应变相比，垫片减小了互连中的应变。 垫片被选择为使得在所需热偏移期间平行于参考平面测量的互连中的面内应变小于用于设计的低循环疲劳中互连材料的热偏移的最大应变差 在所需的热偏移下评估的循环次数。
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