摘要:
Thermosetting compositions consist of a homogeneous mixture of an ethylenically unsaturated compound, a bismaleimide compound or a bismaleimide containing composition and an acid compound, with optionally further copolymerizable compounds and usual additives. The thermosetting composition are useful as a coating resin, a laminating resin or for the manufacture of shaped articles.
摘要:
The invention relates to compositions containing 80-30 wt.-% of bismaleimide-compounds, 5-60 wt.-% maleimide-amide compounds and 1-10 wt.-% of a maleic an hydride derivative. The invention also relates to the preparation of such compositions as well as the homogeneous curable compositions, in a suitable solvent, comprising bismaleimide/maleimide-amide/maleic an hydride. The obtained copolymers show good chemical resistance and a high heat distortion temperature.
摘要:
The invention relates to compositions containing 80-30 weight % of bismaleimide-compounds, 5-60 weight % maleimide-amide compounds and 1-10 weight % maleic anhydride derivative. The invention further relates to the preparation of such compositions and to homogeneous curable compositions comprising bismaleimide/maleimide-amide/maleic anhydride compositions according to the invention. The obtained copolymers show good chemical resistance and a high heat distortion temperature.